High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.

A driver circuit drives an output terminal with an input/output voltage using an NMOS transistor and a PMOS transistor. A pre-driver for the NMOS transistor supplied with a drive voltage and receives a data signal referenced to the drive voltage. A pre-driver for the PMOS transistor has a positive supply input connected to the positive supply rail, a negative supply input receiving a second drive voltage equal to the supply voltage minus the drive voltage. A level shifter circuit, shifts the data signal to be referenced between the supply voltage and the second drive voltage. A charge pump circuit for providing second drive voltage, the charge pump circuit driven with a variable switching frequency proportional to a current of the PMOS transistor.

A level shifter circuit shifts a digital signal between first and second voltage levels. For a LOW to HIGH transition, an output PMOS transistor is switched on using a first NMOS transistor activated by the digital signal at the first voltage level while a second NMOS transistor is switched off to uncouple the output PMOS transistor from ground, and a third NMOS transistor is switched off to uncouple a current mirror circuit from ground. For a HIGH to LOW transition, the output PMOS transistor is switched off and a fourth NMOS transistor is switched on using an output of the current mirror circuit. The second NMOS transistor is switched on using an inverted version of the digital signal, and the current in the current mirror circuit is turned off with a fifth NMOS transistor when the drain of the output PMOS transistor approaches the voltage level of ground.

A level shifter includes a buffer circuit, a first shift circuit, and a second shift circuit. The buffer circuit provides a first signal and a first inverted signal to the first shift circuit, such that the first shift circuit provides a second signal and a second inverted signal to the second shift circuit. The second shift circuit generates a plurality of output signals according to the second signal and the second inverted signal. The first shift circuit includes a plurality of first stacking transistors and a first voltage divider circuit. The first voltage divider circuit is electrically coupled between a first system high voltage terminal and a system low voltage terminal. The first voltage divider circuit is configured to provide a first inner bias to gate terminals of the first stacking transistors.

An interface circuit includes: a buffer circuit configured to receive an input signal and to generate an output signal having a delay time, the delay time being determined based on a current level of a bias current and a voltage level of a power supply voltage; and a bias generation circuit configured to vary a voltage level of a bias control voltage so that the delay time is constant by compensating for a change in the voltage level of the power supply voltage, the bias generation circuit being further configured to provide the bias control voltage to the buffer circuit.

A middle-range (mid) low dropout (LDO) voltage has both sinking and sourcing current capability. The mid LDO can provide a voltage reference in active mode and power mode for core only design to work in a Safe Operating Area (SOA). The output of mid LDO can track TO power and/or core power dynamically. The mid LDO can comprise a voltage reference generator and a power-down controller connected to an amplifier, which output is connected to a decoupling capacitor. The provision of a high ground signal allows the mid LDO provide the sinking and sourcing currents.

Disclosed herein are related to systems and methods for providing different power supply levels. In one aspect, a first circuit generates a first signal having a first amplitude according to a first supply voltage. A latch may be coupled to a resistor of a plurality of resistors coupled in series. One end of the resistor may be configured to provide to the latch a second supply voltage higher than the first supply voltage according to a third supply voltage higher than the second supply voltage, and another end of the resistor may be configured to receive the third supply voltage. The latch may modify the first signal to provide a second signal, according to the second supply voltage. An amplifier may amplify the second signal to provide a third signal having a second amplitude larger than the first amplitude, according to the third supply voltage.

An integrated circuit includes a first metal-insulator-semiconductor capacitor, a second metal-insulator-semiconductor capacitor, and a metal-insulator-metal capacitor. A first terminal of the first metal-insulator-semiconductor capacitor is configured to receive a first reference voltage for a higher voltage domain, while a first terminal of the second metal-insulator-semiconductor capacitor is configured to receive a second reference voltage for the higher voltage domain. A second terminal of the first metal-insulator-semiconductor capacitor is conductively connected to a first terminal of the metal-insulator-metal capacitor, while a second terminal of the second metal-insulator-semiconductor capacitor is conductively connected to a second terminal of the metal-insulator-metal capacitor. The first terminal of the metal-insulator-metal capacitor is configured to receive a first supply voltage for a lower voltage domain, and the first terminal of the second metal-insulator-semiconductor capacitor is configured to receive a second supply voltage for the lower voltage domain.

A semiconductor integrated circuit of embodiments includes a first MOS transistor configured to control conduction and non-conduction between a reference voltage point and a node, a second MOS transistor connected to the first MOS transistor via the node and configured to apply a voltage equal to or lower than a withstand voltage of the first MOS transistor to the node, a third MOS transistor configured to receive supply of a second voltage higher than the first voltage, and output an output signal of a signal level corresponding to a voltage range of the second voltage, and a switch circuit configured to make a voltage of the node a fixed voltage when the first MOS transistor is in an OFF state.

An input/output (I/O) circuit may be provided. The I/O circuit may include an input control circuit and an output control circuit. The input control circuit may be configured to apply a stress to a transmission path based on an input signal while in a test mode and buffer the input signal using a drivability changed by the stress applied to the transmission path to generate first and second transmission signals while in a normal mode after the test mode. The output control circuit may be configured to drive and output an output signal according to the first and second transmission signals based on a test mode signal.