Embodiments of the disclosure are drawn to apparatuses and methods for arranging configurable logic circuits such that the configurable logic circuit may be configured to form one or more of several logic circuits by coupling a combination of nodes included in the logic circuit. Configuring the configurable logic circuit may include modification of a single wiring layer.

A register array includes a plurality of groups of latches. Each of the groups of latches includes a first latch, a second latch, and a test latch connected to the first latch and the second latch. During functional operation the first latch and the second latch process data, in response to the same read/write clock signal supplied simultaneously to the first read/write clock input and the second read/write clock input. During test operation a skewed test clock signal of an original test clock signal is supplied at different timings to the first latch, the second latch, and the test latch, and a single scan signal is input to the first latch. The single scan signal cascades from the first latch through the test latch to the second latch, and is output by the second latch, within a single cycle of the original test clock signal.

An integrated circuit comprising a plurality of logic tiles, wherein each logic tile (i) is physically adjacent to at least one other logic tile of the plurality and (ii) includes a configurable switch interconnect network including a plurality of switches electrically interconnected and arranged into a plurality of switch matrices, wherein the plurality of switch matrices are arranged into a plurality of stages including: (a) at least two of the stages which is configured in a hierarchical network, and (b) a mesh stage, wherein each switch matrix of the mesh stage includes an output that is directly connected to an input of a plurality of different switch matrices of the mesh stage and wherein the mesh stage of switch matrices of each logic tile is directly connected to the mesh stage of switch matrices of at least one other logic tile of the plurality of the logic tiles.

Methods and systems for timing analysis and closure during logic synthesis of synchronous digital circuitry are provided, which may be used to prevent timing conflicts in logic designs that may have data transfers between regions with substantial clock skew. In programmable logic devices having hardened circuitry and programmable fabric, data transfers between memory elements in hardened circuitry and programmable fabric may be subject to substantial clock skews and unknown latencies. Embodiments may employ pre-calculated latencies that may be stored in a file and/or a database, and dynamically retrieved during timing synthesis to determine multicycle constraints to mitigate latencies. Embodiments may employ destination multicycle constraints, which use as reference the clock waveforms delayed due to latency.

A solid-state imaging element includes a first substrate including a pixel circuit having a pixel array unit, and a second substrate. The second substrate includes signal processing circuits to process signals from the pixel array unit, and a wiring layer with wiring regions electrically connected to respective ones of the signal processing circuits. Each signal processing circuit has a same circuit pattern. The second substrate and the first substrate are stacked. A wiring pattern of each wiring region is different.

An integrated circuit comprising a plurality of logic tiles, wherein each logic tile (i) is physically adjacent to at least one other logic tile of the plurality and (ii) includes a configurable switch interconnect network including a plurality of switches electrically interconnected and arranged into a plurality of switch matrices, wherein the plurality of switch matrices are arranged into a plurality of stages including: (a) at least two of the stages which is configured in a hierarchical network, and (b) a mesh stage, wherein each switch matrix of the mesh stage includes an output that is directly connected to an input of a plurality of different switch matrices of the mesh stage and wherein the mesh stage of switch matrices of each logic tile is directly connected to the mesh stage of switch matrices of at least one other logic tile of the plurality of the logic tiles.

Methods and systems for timing analysis and closure during logic synthesis of synchronous digital circuitry are provided, which may be used to prevent timing conflicts in logic designs that may have data transfers between regions with substantial clock skew. In programmable logic devices having hardened circuitry and programmable fabric, data transfers between memory elements in hardened circuitry and programmable fabric may be subject to substantial clock skews and unknown latencies. Embodiments may employ pre-calculated latencies that may be stored in a file and/or a database, and dynamically retrieved during timing synthesis to determine multicycle constraints to mitigate latencies. Embodiments may employ destination multicycle constraints, which use as reference the clock waveforms delayed due to latency.

The disclosure relates to an integrated circuit comprising: a first voltage terminal; a second voltage terminal; and a plurality of logic cells, comprising one or more field effect transistors having a p-type channel and one or more field effect transistors having an n-type channel. The plurality of logic cells comprises a regular subset of cells and a spare subset of cells. Electrical connectors are arranged to: connect the gates of the regular subset of cells in order to provide a functional logic arrangement; connect the gates of the one or more field effect transistors having a p-type channel of the spare subset of cells to the first voltage terminal; and connect the gates of the one or more field effect transistors having an n-type channel of the spare subset of cells to the second voltage terminal.

A device includes a first AND logic gate comprising a first input, a second input, and an output, a second AND logic gate comprising a first input, a second input, and an output, and a first OR logic gate comprising a first input coupled to the output of the first AND logic gate and a second input coupled to the output of the second AND logic gate. A first selection circuit has first and second data inputs, a first control input coupled to the first input of the first AND logic gate and a second control input coupled to the first input of the second AND logic gate. A first D latch includes a data input coupled to an output of the first selection circuit and an activation input coupled to an output of the first OR logic gate and a second D latch includes a data input coupled to the output of the first selection circuit and an activation input coupled to the output of the first OR logic gate.

A dummy cell arrangement in a semiconductor device includes a substrate with a dummy region, unit dummy cells arranged in rows and columns in the dummy region, and flexible extended dummy cells arranged in rows and columns filling up remaining dummy region. The unit dummy cell includes exactly one base dummy cell and exactly two fixed dummy cells at opposite sides of the base dummy cell in row direction or in column direction and the flexible extended dummy cell includes at least two base dummy units and a plurality of flexible dummy units at two opposite sides of the two base dummy units in row direction or in column direction. The base dummy cell consists of at least one fin, at least one gate and at least one contact, while the flexible dummy cell consists of one gate and one contact without any fin.