A logic two-to-one multiplexer includes: two input terminals; one output terminal; a control terminal. Four series-connected two-to-one multiplexers are connected such that a first multiplexer has its inputs connected to the input terminals, a last multiplexer has its output connected to the output terminal, and the other multiplexers have their respective inputs interconnected to the output of the previous multiplexer in the series association. Half of the multiplexers are controlled in reverse with respect to the other half of the multiplexers.

A family of digital logic functions has the same specifications for input and output voltages and the same number of bond pads. A digital logic integrated circuit for the family includes a substrate of semiconductor material having a core area and a peripheral area; a certain number of bond pads formed in the peripheral area, the certain number of bond pads determining the total area of the substrate; programmable digital logic transistor circuitry formed in the core area for each of the digital logic functions in the family; programmable input and output circuitry formed in the peripheral area; programming circuitry for programming the programmable digital logic transistor circuitry into a selected digital logic function; and programmable input and output means for programming the input and output circuitry into input and output circuits for the selected digital logic function.

An integrated circuit according to an embodiment includes: a first block including a first logic block configured to perform a logical operation, a first switch block circuit configured to control connection and non-connection with the first logic block, and a second switch block circuit configured to control connection and non-connection with the first logic block; and a second block including a second logic block configured to perform a logical operation, a third switch block circuit configured to control connection and non-connection with the second logic block, and a fourth switch block circuit configured to control connection and non-connection with the second logic block, wherein the first switch block circuit is mutually connected with the third and fourth switch block circuits, and the second switch block circuit is mutually connected with the third and fourth switch block circuits.

Various techniques are provided to efficiently implement user designs in programmable logic devices (PLDs). In one example, a method includes identifying a multiplexer in the design, identifying one or more irrelevant inputs for the multiplexer by, at least in part, decomposing the select logic into one or more select line binary decision diagrams corresponding to the one or more select lines, and generating a reduced multiplexer by eliminating the one or more irrelevant inputs from the multiplexer. The reduced multiplexer may be used to generate configuration data to configure physical components of the PLD, and the configuration data may be used to program the PLD to conform to the timing constraints of the design and/or PLD.

Integrated circuits such as application specific circuits or programmable logic devices may include specialized blocks such as configurable storage blocks and configurable processing blocks. Such specialized blocks may be controlled by clock signals and operated at single data rate or at double data rate. For instance, configurable storage blocks may be configured to use a double data rate communications scheme or a single data rate communication scheme to communicate data with other blocks. Configurable processing blocks may be configured to process data at a double data rate or a single data rate. Furthermore, configurable processing blocks that include accumulator circuitry may be configured to perform one accumulation at a single data rate or at a double data rate. Such configurable processing blocks may also be configured to perform two accumulations at a single data rate.

An object is to provide a semiconductor device that can maintain the connection relation between logic circuit units or the circuit configuration of each of the logic circuit units even after supply of power supply voltage is stopped. Another object is to provide a semiconductor device in which the connection relation between logic circuit units or the circuit configuration of each of the logic circuit units can be changed at high speed. In a reconfigurable circuit, an oxide semiconductor is used for a semiconductor element that stores data on the circuit configuration, connection relation, or the like. Specifically, the oxide semiconductor is used for a channel formation region of the semiconductor element.

In an example, a memory includes processor profiles to load into a processor. The processor may provide an address to access a processor profile. The address may be modified to select a processor profile to load into the processor.

The present invention discloses a configurable gate array based on three-dimensional printed memory (3D-W). It comprises an array of configurable computing elements, an array of configurable logic elements and an array of configurable interconnects. Each configurable computing element comprises at least a 3D-W array, which is electrically programmable and can be loaded with a look-up table (LUT) for a math function.

Methods, systems, and devices for metadata storage at a memory device are described to support storage of metadata information and error control information at a memory device. The metadata information and error control information may be received at the memory device via a sideband channel and corresponding pin. For example, a set of bits received via the pin may include a subset of error control bits and a subset of metadata bits. Circuitry at the memory device may receive the set of bits via the pin and may identify metadata information and error control information within the set of bits. The circuitry may route the metadata information to a corresponding subset of memory cells and the error control information to an error control circuit, where the error control circuit may route the error control information to a corresponding subset of memory cells.

A multi-chip package includes: a first semiconductor integrated-circuit (IC) chip; a second semiconductor integrated-circuit (IC) chip over and bonded to the first semiconductor integrated-circuit (IC) chip; a plurality of first metal posts over and coupling to the first semiconductor integrated-circuit (IC) chip, wherein the plurality of first metal posts are in a space beyond and extending from a sidewall of the second semiconductor integrated-circuit (IC) chip; and a first polymer layer over the first semiconductor integrated-circuit (IC) chip and in the space, wherein the plurality of first metal posts are in the first polymer layer, wherein a top surface of the first polymer layer, a top surface of the second semiconductor integrated-circuit (IC) chip and a top surface of each of the plurality of first metal posts are coplanar.