A programmable logic circuit (10) for controlling an electrical facility, in particular a nuclear facility, includes an operating unit (14). The operating unit includes a plurality of types of functional blocks (FB.sub.1, FB.sub.i, FB.sub.N), two distinct types of functional blocks being suitable for executing at least one distinct function, at least one processing module suitable for receiving at least one sequence (46) of functional block(s) to be executed, and at least one internal memory (38) configured to store at least said sequence (46). The programmable logic circuit (10) includes a single functional block of each type, a given functional block being suitable for being called several times, and an execution module (22) configured to execute the called functional block(s) in series, according to said sequence (46).

Circuitry is provided that includes programmable fabric with fine-grain routing wires and a separate programmable coarse-grain routing network that provides enhanced bandwidth, low latency, and deterministic routing behavior. The programmable coarse-grain routing network may be implemented on an active interposer die. The programmable fabric may be implemented on a top die that is stacked on the active interposer die. A protocol-based network on chip (NoC) may be overlaid on the coarse-grain routing network. Although the NoC protocol is nondeterministic, the coarse-grain routing network includes an array of programmable switch boxes linked together using a predetermined number of routing channels to provide deterministic routing. Pipeline registers may be interposed within the routing channels at fixed locations to guarantee timing closure.

Circuitry is provided that includes programmable fabric with fine-grain routing wires and a separate programmable coarse-grain routing network that provides enhanced bandwidth, low latency, and deterministic routing behavior. The programmable coarse-grain routing network may be implemented on an active interposer die. The programmable fabric may be implemented on a top die that is stacked on the active interposer die. A protocol-based network on chip (NoC) may be overlaid on the coarse-grain routing network. Although the NoC protocol is nondeterministic, the coarse-grain routing network includes an array of programmable switch boxes linked together using a predetermined number of routing channels to provide deterministic routing. Pipeline registers may be interposed within the routing channels at fixed locations to guarantee timing closure.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die, a volatile memory die, and a logic die. The non-volatile memory die, the volatile memory die, and the logic die are stacked. The 3D SIC is partitioned into a plurality of columns that are perpendicular to each of the stacked dies. Each column of the plurality of columns is configurable to be bypassed via configurable routes. When the configurable routes are used, functionality of a failing part of the column is re-routed to a corresponding effective part of a neighboring column.

A programmable logic device (“PLD”) contains programmable digital signal processing (“DSP”) blocks operable to be selectively programmed to perform one or more logic functions. The PLD, in one embodiment, includes configurable logic blocks (“LBs”), an input and output (“I/O”) block, and programmable DSP blocks. The configurable LBs are able to be selectively programmed to perform one or more logic functions. The I/O block includes I/O ports for facilitating data transfer. The programmable DSP blocks are configured to perform various predefined logic functions. Each of the programmable DSP blocks, in one aspect, includes at least one configurable DSP which, in one embodiment, includes a 27×18 multiplier and a 12×12 multiplier.

A reconfigurable circuit includes: a first line; a first switch element disposed between the first line and a first power source line of first voltage; a second line; a second switch element disposed between the second line and a second power source line of second voltage which is different from the first voltage; and a resistive switch assembly disposed between the first line and the second line. The resistive switch assembly includes: a first non-volatile resistive switch; and a second non-volatile resistive switch whose first end is coupled to a first end of the first non-volatile resistive switch. The second end of the first non-volatile resistive switch is coupled to the first line, and the second end of the second non-volatile resistive switch is coupled to the second line.

A reconfigurable circuit includes: a first line; a first switch element disposed between the first line and a first power source line of first voltage; a second line; a second switch element disposed between the second line and a second power source line of second voltage which is different from the first voltage; and a resistive switch assembly disposed between the first line and the second line. The resistive switch assembly includes: a first non-volatile resistive switch; and a second non-volatile resistive switch whose first end is coupled to a first end of the first non-volatile resistive switch. The second end of the first non-volatile resistive switch is coupled to the first line, and the second end of the second non-volatile resistive switch is coupled to the second line.

A field-programmable gate array (FPGA) architecture capable of performing immutable hardware Root-of-Trust updates and patches. In embodiments, the architecture utilizes the dielectric breakdown mechanism of magneto tunnel junctions (MTJ) to operate both as: 1) multi-time programmable (MTP) configuration memory for reconfigurable FPGA designs, and 2) one-time programmable (OTP) memory for FPGA Root-of-Trust sections.

A logic circuit comprising: inputs for receiving multiple n-bit numbers, n being greater than one; and an adder capable of receiving m n-bit numbers, m being greater than one, and forming an output representing the sum of those numbers, the adder having a plurality of single-bit stages and being configured to form the sum by subjecting successive bits of each of the numbers to an operation in a respective one of the single-bit stages, the single-bit stages being such that the adder has insufficient capacity to add all possible combinations of bits in a respective bit position of m n-bit numbers; the addition circuit being configured to add the multiple n-bit numbers by: in the adder, adding a first one of the n-bit numbers to a value corresponding to a set of non-consecutive bits of another of the n-bit numbers to form a first intermediate value; adding the first intermediate value to a value corresponding to the bits of the said other of the n-bit numbers other than those in the said set to form a sum; and outputting the sum.