H03K19/17724

HARDWARE-SOFTWARE DESIGN FLOW WITH HIGH-LEVEL SYNTHESIS FOR HETEROGENEOUS AND PROGRAMMABLE DEVICES

Implementing an application within an integrated circuit (IC) having a data processing engine (DPE) array coupled to a Network-on-Chip (NoC) can include determining, using computer hardware, data transfer requirements for a software portion of the application intended to execute on the DPE array by simulating data traffic to the NoC as generated by the software portion, generating, using the computer hardware, a NoC routing solution for data paths of the application implemented by the NoC based, at least in part, on the data transfer requirements for the software portion. The software portion can be compiled for execution by different ones of a plurality of DPEs of the DPE array based, at least in part, on the NoC routing solution. Configuration data can be generated using the computer hardware. The configuration data, when loaded into the IC, configures the NoC to implement the NoC routing solution.

Width and frequency conversion with PHY layer devices in PCI-express
11239843 · 2022-02-01 · ·

A system and apparatus can include a first port configured to support a first link width; a second port configured to support a second link width, the second link width different from the first link width; and physical layer logic to receive from the first port a first data block arranged according to the first link width and frequency; create at least one second data block arranged according the second link width and frequency, the at least one second data block including data bytes from the first data block arranged sequentially in the at least one second data block; and transmit the at least one second data block to the second port.

Width and frequency conversion with PHY layer devices in PCI-express
11239843 · 2022-02-01 · ·

A system and apparatus can include a first port configured to support a first link width; a second port configured to support a second link width, the second link width different from the first link width; and physical layer logic to receive from the first port a first data block arranged according to the first link width and frequency; create at least one second data block arranged according the second link width and frequency, the at least one second data block including data bytes from the first data block arranged sequentially in the at least one second data block; and transmit the at least one second data block to the second port.

Device monitoring using satellite ADCS having local voltage reference
11199581 · 2021-12-14 · ·

Systems and methods for monitoring a number of operating conditions of a programmable device are disclosed. In some implementations, the system may include a root monitor including circuitry configured to generate a reference voltage, a plurality of sensors and satellite monitors distributed across the programmable device, and a network-on-chip (NoC) interconnect system coupled to the root monitor and to each of the plurality of satellite monitors. Each of the satellite monitors may be in a vicinity of and coupled to a corresponding one of the plurality of sensors via a local interconnect.

Device monitoring using satellite ADCS having local voltage reference
11199581 · 2021-12-14 · ·

Systems and methods for monitoring a number of operating conditions of a programmable device are disclosed. In some implementations, the system may include a root monitor including circuitry configured to generate a reference voltage, a plurality of sensors and satellite monitors distributed across the programmable device, and a network-on-chip (NoC) interconnect system coupled to the root monitor and to each of the plurality of satellite monitors. Each of the satellite monitors may be in a vicinity of and coupled to a corresponding one of the plurality of sensors via a local interconnect.

Unified programmable computational memory and configuration network
11201623 · 2021-12-14 · ·

Examples generally relate a programmable device having a unified programmable computational memory (PCM) and configuration network. In an example, a programmable device includes a die that includes a PCM integrated circuit having a PCM tile. The PCM tile includes a configuration memory (CM) and combinational logic (CL). The CM is capable of storing configuration data received via a node in the PCM tile. The CL is configured to receive internal control signal(s) and first and second input signals and to output a result signal. The CL is capable of outputting the result signal resulting from a logic function that is responsive to the internal control signal(s) and a signal of a group of signals including the first and second input signals. The CL is configured to receive the first input signal via the node in the PCM tile.

Unified programmable computational memory and configuration network
11201623 · 2021-12-14 · ·

Examples generally relate a programmable device having a unified programmable computational memory (PCM) and configuration network. In an example, a programmable device includes a die that includes a PCM integrated circuit having a PCM tile. The PCM tile includes a configuration memory (CM) and combinational logic (CL). The CM is capable of storing configuration data received via a node in the PCM tile. The CL is configured to receive internal control signal(s) and first and second input signals and to output a result signal. The CL is capable of outputting the result signal resulting from a logic function that is responsive to the internal control signal(s) and a signal of a group of signals including the first and second input signals. The CL is configured to receive the first input signal via the node in the PCM tile.

HIGH-SPEED CORE INTERCONNECT FOR MULTI-DIE PROGRAMMABLE LOGIC DEVICES
20210384911 · 2021-12-09 ·

Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

HIGH-SPEED CORE INTERCONNECT FOR MULTI-DIE PROGRAMMABLE LOGIC DEVICES
20210384911 · 2021-12-09 ·

Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

Programmable device having hardened circuits for predetermined digital signal processing functionality

An example programmable device includes a configuration memory configured to store configuration data; a programmable logic having a configurable functionality based on the configuration data in the configuration memory; a signal conversion circuit; a digital processing circuit; an endpoint circuit coupled to the signal conversion circuit through the digital processing circuit; wherein the digital processing circuit includes a first one or more digital processing functions implemented as hardened circuits each having a predetermined functionality, and a second one or more processing functions implemented by the configurable functionality of the programmable logic.