Provided is a semiconductor device in which leakage current due to miniaturization of a semiconductor element is reduced and delay at a time of context switch of a multi-context PLD is reduced. A first transistor and a second transistor included in a charge retention circuit functioning as a configuration memory each include an oxide semiconductor in a semiconductor layer serving as a channel formation region. One of a source and a drain of the first transistor is electrically connected to a gate of the second transistor. One of a source and a drain of the second transistor is connected to a switch for context switch. In the switch used for context switch, electrostatic capacitance on an input side to which the one of the source and the drain of the second transistor is connected is larger than electrostatic capacitance on an output side.

A feedback control system may include a feedback controller for controlling a plant using pulse density signals. The feedback controller may include a pulse density signal generator and a controller logic circuit. The pulse density signal generator may receive input command signals and generate signed or unsigned pulse density input signals. The controller logic may receive the pulse density input signals from the pulse density signal generator and feedback pulse density signals from the plant and may generate corresponding pulse density control signals for controlling the plant based on the input command signals. The controller logic may include a sign change logic, an addition circuit, and an optional amplifier circuit. The pulse density signal generator may also include rate transition circuits for ensuring that the pulse density input signals and the feedback pulse density signals are uncorrelated.

A 3D device, the device including: a first stratum including an array of memory bit cells, the array of memory bit cells is controlled via a plurality of bit-lines and a plurality of word-lines; and a second stratum overlaying the first stratum, the second stratum including memory control circuits, where the control circuits provide control of the plurality of bit-lines and the plurality of word-lines.

System and method for training and performing operations (e.g., read and write operations) on a double buffered memory topology. In some embodiments, eight DIMMs are coupled to a single channel. The training and operations schemes are configured with timing and signaling to allow training and operations with the double buffered memory topology. In some embodiments, the double buffered memory topology includes one or more buffers on a system board (e.g., motherboard).

System and method for training and performing operations (e.g., read and write operations) on a double buffered memory topology. In some embodiments, eight DIMMs are coupled to a single channel. The training and operations schemes are configured with timing and signaling to allow training and operations with the double buffered memory topology. In some embodiments, the double buffered memory topology includes one or more buffers on a system board (e.g., motherboard).

A 3D semiconductor device including: a first layer including a first monocrystalline layer, the first layer including first logic cells; a second layer including a monocrystalline semiconductor layer, the second layer overlying the first layer, the second layer including second transistors, where the logic cells include a Look-Up-Table logic cell, and where the second transistors are aligned to the first logic cells with less than 200 nm alignment error.

A high-speed memory circuit architecture for arrays of resistive change elements is disclosed. An array of resistive change elements is organized into rows and columns, with each column serviced by a word line and each row serviced by two bit lines. Each row of resistive change elements includes a pair of reference elements and a sense amplifier. The reference elements are resistive components with electrical resistance values between the resistance corresponding to a SET condition and the resistance corresponding to a RESET condition within the resistive change elements being used in the array. A high speed READ operation is performed by discharging one of a row's bit lines through a resistive change element selected by a word line and simultaneously discharging the other of the row's bit lines through of the reference elements and comparing the rate of discharge on the two lines using the row's sense amplifier. Storage state data are transmitted to an output data bus as high speed synchronized data pulses. High speed data is received from an external synchronized data bus and stored by a PROGRAM operation within resistive change elements in a memory array configuration.

A feedback control system may include a feedback controller for controlling a plant using pulse density signals. The feedback controller may include a pulse density signal generator and a controller logic circuit. The pulse density signal generator may receive input command signals and generate signed or unsigned pulse density input signals. The controller logic may receive the pulse density input signals from the pulse density signal generator and feedback pulse density signals from the plant and may generate corresponding pulse density control signals for controlling the plant based on the input command signals. The controller logic may include a sign change logic, an addition circuit, and an optional amplifier circuit. The pulse density signal generator may also include rate transition circuits for ensuring that the pulse density input signals and the feedback pulse density signals are uncorrelated.

A high-speed memory circuit architecture for arrays of resistive change elements is disclosed. An array of resistive change elements is organized into rows and columns, with each column serviced by a word line and each row serviced by two bit lines. Each row of resistive change elements includes a pair of reference elements and a sense amplifier. The reference elements are resistive components with electrical resistance values between the resistance corresponding to a SET condition and the resistance corresponding to a RESET condition within the resistive change elements being used in the array. A high speed READ operation is performed by discharging one of a row's bit lines through a resistive change element selected by a word line and simultaneously discharging the other of the row's bit lines through of the reference elements and comparing the rate of discharge on the two lines using the row's sense amplifier. Storage state data are transmitted to an output data bus as high speed synchronized data pulses. High speed data is received from an external synchronized data bus and stored by a PROGRAM operation within resistive change elements in a memory array configuration.

A 3D semiconductor device including: a first layer including a first monocrystalline layer, the first layer including first logic cells; a second layer including a monocrystalline semiconductor layer, the second layer overlying the first layer, the second layer including second transistors, where the logic cells include a Look-Up-Table logic cell, and where the second transistors are aligned to the first logic cells with less than 200 nm alignment error.