Disclosed are a decorative functional film (100) and an electronic device rear cover module (300) with the decorative functional film (100). The decorative functional film (100) includes: a micro-nano layer (11) including a plurality of convex and/or concave micro-nano structures (111); a reflective layer (12) covering the micro-nano layer (11); a coloring layer (13) covering the reflective layer (12); and a functional layer (14) including a conductive layer (341). The decorative functional film (100) has both decorative and functional properties.

According to various embodiments of the present disclosure, an electronic device may comprise a housing including a front plate and a rear plate and a display. At least one of the front plate or the rear plate may include a plate exposed to an outside. The plate may include a metal member including a first metal and an oxide layer formed on at least one surface of the metal member. The metal member may comprise a first portion including irregularities formed by at least one second metal included in a first solution, the at least one second metal being substituted for the a portion of the metal member, the at least one second metal being removed from the metal member by the first solution and a flat second portion etched by the first solution.

This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.

Various embodiments of the present invention relate to an electronic device including a liquid crystal, the electronic device including: a piece of glass; a display disposed under a first region of the piece of glass; a power supplying module; one or more electrode films; and one or more liquid crystal layers disposed between the one or more electrode films. The electronic device may also include: a light reflection member (e.g., cholesteric liquid crystal) disposed under a second region of the piece of glass; a processor operatively connected to the display, the power supplying module, and the light reflection member; and a memory operatively connected to the processor. The processor can check the content to be displayed through the display, and can use the power supplying module to supply power to the light reflection member on the basis of at least the checked content, so that the one or more liquid crystal layers reflects at least a portion of light incident from the outside of the electronic device. In addition, other embodiments are possible.

A cover includes a cover body and a first line layer. The cover body is made of an insulating material, and the first line layer is made of a conductive material. The first line layer is completely built into the cover body, and the first line layer is configured to form a radiator, and is coupled to a radio frequency transceiver circuit of an electronic device. The first line layer includes a plurality of first conducting wires and a plurality of second conducting wires. The plurality of first conducting wires are arranged at intervals in a first direction, and the plurality of second conducting wires are arranged at intervals in a second direction. The plurality of first conducting wires and the plurality of second conducting wires are disposed intersecting each other. The first direction is different from the second direction.

A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

Provided are an electronic device housing and a manufacturing method therefor, and an electronic device. The electronic device housing comprises: a housing body, wherein the housing body comprises a bottom wall and at least one side wall connected to the bottom wall, an outer surface of the bottom wall is a flat surface or a curved surface, an outer surface of the side wall is a curved surface, and at least a part of the surface of at least one of the bottom wall and the side wall is provided with a millimeter-scale three-dimensional texture.

A rear cover of an electronic device is provided. The rear cover includes a glass substrate including a first face facing a first direction, a second face facing a second direction opposite to the first direction, and at least one side face disposed between the first face and the second face, a roughness layer formed on the first face and having a first roughness, a hairline pattern formed on the roughness layer and having a second roughness, and a hard coating layer formed on the roughness layer and the hairline pattern.

According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.

Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.