Methods, systems, computer-readable media, and apparatuses for dynamic pixel binning are presented. In one example, an image sensor system includes a plurality of sensor elements; a plurality of floating diffusion regions in communication with the plurality of sensor elements, each floating diffusion region of the plurality of floating diffusion regions configured to be selectively enabled; and at least one comparison circuit coupled to at least two floating diffusion regions of the plurality of floating diffusion regions, the comparison circuit configured to: receive input signals from the two floating diffusion regions, compare the input signals, and output a comparison signal based on the comparison of the input signals.

An imager integrated circuit intended to cooperate with an optical system configured to direct light rays from a scene to an inlet face of the circuit, the circuit being configured to perform a simultaneous stereoscopic capture of N images corresponding to N distinct views of the scene, each of the N images corresponding to light rays directed by a portion of the optical system which is different from those directing the rays corresponding to the N−1 other images, including: N subsets of pixels made on a same substrate, each of the N subsets of pixels being intended to perform the capture of one of the N associated images, means interposed between each of the N subsets of pixels and the inlet face of the circuit, and configured to pass the rays corresponding to the image associated with said subset of pixels and block the other rays.

In order to improve imaging performance, an imaging apparatus is provided to include an image capturing unit configured to detect incident light and generate a raw image data, a compression unit configured to compress the raw image data to generate a coded data having a data amount smaller than that of the raw image data, and an output unit configured to output the coded data to a processing unit for processing the coded data. Furthermore, the image capturing unit, the compression unit, and the output unit are configured to be within a same semiconductor package.

An image sensor system with an image sensor that generates a first image and a second image. The first and second images are transmitted to a processor in a time overlapping manner. By way of example, the images may be transferred to the processor in an interleaving manner or provided on separate dedicated busses.

Aspects of the present disclosure are directed to sensing apparatuses and methods. As may be implemented in accordance with one or more embodiments, analog signals are obtained from a plurality of sensors and used to provide an output for particular ones of the sensors as follows. Analog signals are obtained from a particular sensor and one or more adjacent sensors. Different weighting factors are applied to the analog signals, based on the position of the sensor or sensors. The signals with the weighting factors applied thereto are combined to provide an output signal.

In a state that a plurality of capacitances are connected between input and output nodes of an amplifier, a short circuit is established between the input and output nodes of the amplifier. In a state that at least one of the capacitances is isolated from the input and output nodes of the amplifier, the plurality of capacitances are connected to the input and output nodes of the amplifier, in a case that an output from the amplifier is larger than a threshold.

The present technology relates to a semiconductor device and a method of manufacturing the same, a semiconductor module, and an electronic device capable of more certainly improving an optical characteristic and chromatic aberration. A semiconductor package provided with a pedestal having a cylindrical shape including a curved surface curved so as to be concave to a light incident side, and a linear image sensor on which a plurality of pixels each including a photoelectric conversion element is arranged in a one-dimensional direction, the linear image sensor fixed on the curved surface on which a light-receiving area formed of a plurality of pixels is curved so as to be concave to the light incident side is provided. The present technology may be applied to the semiconductor package used in an image reading device, for example.

The invention relates to a structure of an active pixel of the CMOS type (1) that comprises: at least one photodiode (10), characterized in that it comprises means for reading any bias voltage in the evolution phase of the photodiode (10) upon exposure.

The invention relates to pixel circuit and an operating method thereof, comprising—a front-end circuit (1) comprising a single photodiode (PD) and having an output (4), said front-end circuit (1) being configured for delivering on said output a photoreceptor signal derived from a light exposure of said single photodiode (PD);—a transient detector circuit (2) configured for detecting a change in said photoreceptor signal delivered on said output (4);—an exposure measurement circuit (3) configured for measuring said photoreceptor signal delivered on said output (4) upon detection by the transient detector circuit (2) of a change in the photoreceptor signal. The invention also relates to an image sensor comprising a plurality of pixel circuits

Systems and method are provided for generating an image of an environment of a vehicle. In one embodiment, a method includes: determining, by a processor, a first position of a plurality of positions within a first field of view; controlling, by the processor, a discrete scanning device based on the first position; capturing, by an imaging device, pixel data for a plurality of pixels within a second field of view associated with the first position, wherein the second field of view is within the first field of view; and combining, by the processor, the pixel data from the second field of view with pixel data captured from a third field of view associated with one of the plurality of positions to form image data depicting the environment of the vehicle.