Imaging apparatus (100, 200, 1200) includes a semiconductor substrate (312) and an array (202) of pixel circuits (1202, 1204), which are arranged in a matrix on the semiconductor substrate and define respective pixels (212) of the apparatus. Pixel electrodes (1208) are respectively coupled to the pixel circuits, and a photosensitive (1206) is formed over the pixel electrodes. A common electrode (1207), which is at least partially transparent, is formed over the photosensitive film. An opaque metallization layer (1214) is formed over the photosensitive film on one or more of the pixels and coupled in ohmic contact to the common electrode. Control circuitry (208, 1212) is coupled to apply a bias to the common electrode via the opaque metallization layer while correcting a black level of the output values from the pixels using the signals received from the one or more of the pixels over which the opaque metallization layer is formed.

An image sensor includes a photoelectric converter to generate charges in response to incident light and to provide the generated charges to a first node, a transfer transistor to provide a voltage of the first node to a floating diffusion node based on a first control signal, a source follower transistor to provide a voltage of the floating diffusion node as a unit pixel output, a correlated double sampler (CDS) to receive the unit pixel output and to convert the unit pixel output into a digital code. The first control signal having first, second, and third voltages is maintained at the second voltage in a period between when the voltage of the first node is provided to the floating diffusion node and when the CDS is provided with the voltage of the first node as the unit pixel output.

The present disclosure relates to a solid-state image capture element in which, at least two or more of the discharge driving units are arranged in series between the photoelectric conversion unit and the discharge unit. During capturing of a still image, when a reset operation of the photoelectric conversion unit is performed in starting exposure of the pixel, driving is performed such that after potentials of all the discharge driving units arranged in series are reduced and the charge remaining in the photoelectric conversion unit is discharged to the discharge unit, the potential of the discharge driving unit on the photoelectric conversion unit side is returned to an original potential first, and then the potential of another discharge driving unit is returned to an original potential. The present technology can be applied to a CMOS image sensor which performs imaging by, for example, a global shutter method.

An apparatus for taking moving pictures, a method for taking moving pictures, and a novel pixel sensor array are disclosed. The apparatus includes a rectangular imaging array, a plurality of column processing circuits, and a controller. The rectangular imaging array is characterized by a plurality of rows and columns of UHDR pixel sensors and a plurality of readout lines, and a plurality of row select lines. Each column processing circuit is connected to a corresponding one of the plurality of readout lines. The controller causes the rectangular imaging array to measure a plurality of images of a scene that is illuminated by a pulsating light source characterized by an illumination period and a dark period. Each of the images is generated in a frame period which includes an exposure period and a dead period, the dead period being less than the dark period.

A photoelectric conversion apparatus including pixels is provided. Each pixels comprises a photoelectric converter, a floating diffusion, a transfer transistor between the photoelectric converter and the floating diffusion, a reset transistor resetting the floating diffusion, and an amplification transistor outputting a signal from the pixel to a signal line. An accumulation period includes, sequentially, a first period supplying a first voltage to a gate of the reset transistor, a second period supplying a second voltage to the gate, and a third period supplying a third voltage to set the reset transistor to the OFF to the gate. The first voltage is a voltage that falls between the second voltage and the third voltage, the second period is started before the signal is output, and the second period is longer than the third period.

Two separate schemes are used for detecting light intensity in low light conditions and high light conditions. In high light conditions, two threshold voltages are set and the time between the crossing of a sensor voltage at the two threshold voltages is measured to determine the light intensity in the high light conditions. In low light conditions, a comparator is used to compare the voltage level of the sensor voltage relative to a reference voltage that increase over time. The time when the reference voltage reaches the sensor voltage level is detected to determine the light intensity in the low light conditions.

According to an aspect of the present invention, provided is a solid state imaging device including a plurality of pixels, and each of the pixels has a charge accumulation region of a first conductivity type that accumulates signal charges corresponding to an incident light, a drain region of the first conductivity type to which a predetermined voltage is applied, a drain gate located between the drain region and the charge accumulation region in a planar view, and a semiconductor region of the first conductivity type connected to the charge accumulation region and the drain region.

An image sensor semiconductor device includes a semiconductor substrate and a first photodiode disposed in the semiconductor substrate and configured to generate charges in response to radiation. The image sensor semiconductor device also includes a first transistor disposed adjacent to the first photodiode, and a second transistor disposed over the first photodiode, wherein the first transistor and the second transistor are configured to generate at least one electric field to move the charges generated by the first photodiode. The image sensor device further includes a floating diffusion region configured to store the moved charges.

Among other things, techniques and systems are provided for identifying when a pixel of an image sensor is in an idle period. A flag is utilized to differentiate when the pixel is in an idle period and when the pixel is in an integration period. When the flag indicates that the pixel is in an idle period, a blooming operation is performed on the pixel to reduce an amount of electrical charge that has accumulated at the pixel or to mitigate electrical charge from accumulating at the pixel. In this way, the blooming operation reduces a probability that the photosensitive sensor becomes saturated during an idle period of the pixel, and thus reduces the likelihood of electrical charge from a pixel that is not intended contribute to an image from spilling over and potentially contaminating a pixel that is intended to contribute to the image.

The present technology relates to a solid-state imaging apparatus, a manufacturing method therefor, and an electronic apparatus by which fine pixel signals can be suitably generated. A charge accumulation section that is formed on a first semiconductor substrate and accumulates photoelectrically converted charges, a charge-retaining section that is formed on a second semiconductor substrate and retains charges accumulated in the charge accumulation section, and a transfer transistor that is formed on the first semiconductor substrate and the second semiconductor substrate and transfers charges accumulated in the charge accumulation section to the charge-retaining section are provided. A bonding interface between the first semiconductor substrate and the second semiconductor substrate is formed in a channel of the transfer transistor.