The present invention relates to a vehicle door, which is installed on the vehicle. The door includes a shutter, a speaker and an inverted tube. The shutter has an accommodation cavity, and the speaker is installed in the shutter. The inverted tube is located in the accommodation cavity, with one end connected with the interior of the vehicle, and the other end forming an acoustic port with a flange. The inverted tube exports the sound from the rear cavity into the car. The inverted tube with the acoustic port can strengthen the resonance effect of the air, and strengthen the sound wave. It can improve the loudness of the speaker, reduce the noise of the airflow, and effectively improve the sound quality of the speaker.

A speaker may be configured with at least one diaphragm positioned proximal to and separated from an array of magnets. The diaphragm may consist of a substrate and at least one patterned electrically conductive trace with a portion of the diaphragm knurled to provide a ridge extending a height above the diaphragm that is at least twice a thickness of the diaphragm.

A sound radiation apparatus includes a speaker, a first cover having an opening area provided to be superposed above at least a sound radiation port of the speaker and made up of multiple opening portions at a location superposed above the speaker, a second cover superposed on a front side of the first cover while surrounding the opening area of the first cover, and a saran net covering the first cover and a front side of the second cover and bonded to the second cover, wherein the second cover and the saran net are bonded together at an area on the second member excluding a portion surrounding the opening area of the first cover with a first adhesive and an area on the second cover surrounding the opening area of the first cover with a second adhesive having a higher bonding strength than that of the first adhesive.

The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

Some embodiments of the present invention disclose a miniature sounder. The miniature sounder includes a frame, and a vibration system and a magnetic system that are fixedly connected to the frame; the magnetic system includes a lower clamping board, a primary magnet that disposed on the lower clamping board, a cushion that disposed on the lower clamping board and surrounding the primary magnet and a secondary magnet that disposed on the cushion and surrounding the primary magnet, the cushion being disposed between the secondary magnet and the lower clamping board; and the vibration system includes a voice diaphragm, a voice coil that disposed below the voice diaphragm and causing the voice diaphragm to vibrate and generate a sound and a vibration diaphragm elastically supporting the voice coil, the vibration diaphragm comprising a corrugated rim portion, a fixing portion and a connecting portion.

A speaker assembly may be for being resiliently mounted to spaced apart frame members of a vehicle. The speaker assembly may include an elongate housing having a respective retention chamber at each opposing end, and audio speakers and associated wireless receiver circuitry carried by the housing. The speaker assembly may also include a respective inboard elastomeric body within each retention chamber, and a respective vehicle frame mounting bracket at each end of the elongate housing and to be mounted to an adjacent frame member of the vehicle. The assembly may further include respective fasteners coupling each vehicle frame mounting bracket to the elongate housing via a corresponding inboard elastomeric body so that each vehicle frame mounting bracket is resiliently coupled to the elongate housing.

A microphone module disposed in an electronic device for reducing echo noise. The microphone module includes a casing, a first diaphragm disposed in the casing, a second diaphragm disposed in the casing and a substrate disposed between the first diaphragm and the second diaphragm and joined to the casing to define a first space and a second space which are isolated and separated from each other. The first diaphragm is disposed in the first space, the second diaphragm is disposed in the second space, and the substrate is electrically connected with the first diaphragm and the second diaphragm.

Electronic equipment includes a cover including a first hole, a printed circuit having at least one microphone mounted thereon and including a second hole, a heatsink including a third hole, a thermal pad including a fourth hole, and a compression element, the electronic equipment being arranged in such a manner that the first hole, the second hole, the third hole, and the fourth hole together define an acoustic duct that is arranged to enable the microphone to pick up sound signals coming from outside the electronic equipment, and in such a manner that the compression element compresses the thermal pad around the acoustic duct in order to ensure sound-proofing of the acoustic duct.

There is provided a speaker device 1 having a speaker unit 10 and an enclosure 30 in which a plurality of rod-shaped bodies 31 is integrally bonded to each other and which is arranged in a space behind the speaker unit 10. Thus, a sound wave output from the speaker unit 10 to the rear side thereof can be more effectively damped.

A microphone assembly includes: a microphone with a first acoustic port, wherein the microphone is configured to convert acoustic waves into an electric signal; a filter housing with a second acoustic port; and a carrier coupled to the microphone and to the filter housing, wherein the carrier and the filter housing together enclose a cavity with a first acoustic passage fluidly connecting the first acoustic port and the second acoustic port; wherein the cavity comprises an acoustic chamber and a second acoustic passage; and wherein the second acoustic passage is in fluid communication with the first acoustic passage and with the acoustic chamber, and wherein the acoustic chamber and the second acoustic passage together establish a Helmholtz resonator for suppressing acoustic energy within a first frequency band in the acoustic waves propagating through the first acoustic passage, wherein the first frequency band is in an ultrasound frequency domain.