H04R1/342

ACOUSTIC OUTPUT DEVICE

The present disclosure relates to a pair of glasses. The pair of glasses may include a frame, one or more lenses, and one or more temples. The pair of glasses may further include at least one low-frequency acoustic driver, at least one high-frequency acoustic driver, and a controller. The at least one low-frequency acoustic driver may be configured to output sounds from at least two first guiding holes. The at least one high-frequency acoustic driver may be configured to output sounds from at least two second guiding holes. The controller may be configured to direct the low-frequency acoustic driver to output the sounds in a first frequency range and direct the high-frequency acoustic driver to output the sounds in a second frequency range. The second frequency range may include one or more frequencies higher than one or more frequencies in the first frequency range.

Audio collection system and method for sound capture, broadcast, analysis, and presentation
11646039 · 2023-05-09 ·

At least a system or a method is provided for remote delivery or collection of a device such as an audio collection device. For example, a device comprising an aperture collection and retrieval pin is provided. An apparatus is provided having an aperture receiver, an aperture drive gear and a drive motor. The drive motor is configured to drive the aperture drive gear to open or close the aperture receiver of the apparatus for retrieving or releasing the device comprising the aperture collection pin.

Adapters for microphones and combinations thereof

A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

MEMS TRANSDUCER PACKAGE

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).

MEMS TRANSDUCER PACKAGE

A MEMS transducer package (1) is provide having a semiconductor die portion (3) with a thickness bounded by a first surface (9) and an opposite second surface (11). The package further has a transducer element (13) incorporated in the second surface (11) and a die back volume (7) that extends through the thickness of the semiconductor die portion (3) between the first surface (9) and the transducer element (13). The package is completed by a cap portion (23) that abuts the semiconductor die portion (3) at the first surface (9).

MEMS TRANSDUCER PACKAGE

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.

PROGRAMMABLE INTERACTIVE SYSTEMS, METHODS AND MACHINE READABLE PROGRAMS TO AFFECT BEHAVIORAL PATTERNS
20230201517 · 2023-06-29 ·

Implementations of a programmable interactive system to interact with a user to alter a user's behavioral patterns are provided. Such systems can include one or more of a processor, at least one input sensor operably coupled to the processor to sense at least one sensor input, at least one output device to output at least one stimulus to be observed by the user, a core unit to interact with the user, the core unit being operably coupled to the processor, and a non-transitory machine-readable medium embodying a set of machine readable instructions that, when executed by the processor, cause the system to detect one or more sensor inputs by way of the at least one sensor, analyze said at least one or more sensor inputs to identify a parameter describing the status of the user, and responsive to determining the parameter describing the status of the user, causing the at least one output device to change output of at least one stimulus that is observable by the user.

DIRECTIONAL MICROPHONE INTEGRATED INTO DEVICE CASE
20170374443 · 2017-12-28 · ·

A case for a portable electronic device includes an enclosed, elongated space extending within the case from an opening in an interior surface of the case. The opening corresponds to the location of a microphone in the device. The enclosed space is tapered to an increasingly smaller cross-section as it extends away from the opening. A first edge of the enclosed space aligns along most of its length with an exterior surface of the case. A screen covers a second opening in the exterior surface of the case along the first edge of the elongated space and provides an acoustic resistance between the elongated space and air outside the case through the second opening. A gasket located at the first opening couples the elongated space to the microphone of the electronic device.

MICROPHONE PACKAGE AND ELECTRONIC APPARATUS INCLUDING THE SAME
20230199358 · 2023-06-22 · ·

A microphone package and an electronic apparatus including the same are provided. The microphone package includes a substrate in which an acoustic hole and a via hole are formed; an acoustic sensor attached to a front surface of the substrate and covering the acoustic hole; a first electrode pad provided on the front surface of the substrate; a second electrode pad provided on a rear surface of the substrate and electrically connected to the first electrode pad through the via hole; and a third electrode pad on a side surface of the substrate and electrically connected to the second electrode pad.

Portable speaker system

A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.