Techniques described herein generally relate to generating an audio signal with a speaker. In some examples, a speaker device is described that includes a membrane, an acoustic cavity and an acoustic channel. The membrane can be configured to oscillate along a first directional path and to generate an acoustic signal. The acoustic signal traverses the acoustic channel and generates an audio signal.

Techniques described herein generally relate to generating an audio signal with a speaker. In some examples, a speaker device is described that includes a membrane, an acoustic cavity and an acoustic channel. The membrane can be configured to oscillate along a first directional path and to generate an acoustic signal. The acoustic signal traverses the acoustic channel and generates an audio signal.

In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.

In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.

A speaker comprises a housing having an opening; a waterproof sound-transmission membrane disposed on the housing to cover the opening of the housing; a speaker unit housed in the housing, the speaker unit comprising a speaker having a diaphragm; and an annular polymer membrane disposed between the diaphragm and the waterproof sound-transmission membrane, the annular polymer membrane comprising a through-opening in a radial direction with respect to the annular polymer membrane.

A speaker comprises a housing having an opening; a waterproof sound-transmission membrane disposed on the housing to cover the opening of the housing; a speaker unit housed in the housing, the speaker unit comprising a speaker having a diaphragm; and an annular polymer membrane disposed between the diaphragm and the waterproof sound-transmission membrane, the annular polymer membrane comprising a through-opening in a radial direction with respect to the annular polymer membrane.

The invention relates to audio transducer technology, including audio tuning systems to be utilised in personal audio devices, such as headphone, earphones, mobile phones and the like. The audio tuning system optimises the frequency response of the personal audio device by using Diffuse Field curve characteristics. The audio transducers of the personal audio device incorporate low resonance designs, including low resonance transducer and diaphragm suspensions to further optimise the sound quality of the device. The invention also relates to an audio transducer diaphragm construction that includes a three-dimensional lattice which may be utilised in any audio transducer application.

The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.