An electronic device includes a display element, a piezoelectric element, and a cushioning element. The display element has a display surface and a non-display surface opposite to the display surface. The piezoelectric element is disposed on the non-display surface. The cushioning element is disposed between the display element and the piezoelectric element, and a space is surrounded by the display element, the piezoelectric element, and the cushioning element.

A sound production device includes a substrate having a cavity and a plurality of cantilever diaphragms fixed on the substrate. Each of the plurality of the cantilever diaphragms includes a fixed end fixed on the substrate and a free end extending from the fixed end to a position suspended above the cavity. The free end includes a first surface and a second surface oppositely arranged. The free end and the substrate or other free ends are spaced to form a gap. The sound production device further includes a first dielectric elastomer actuator, a second dielectric elastomer actuator, and a flexible connector. The sound production device of the present disclosures adopts dielectric elastomer actuators on both of the upper and lower sides of the cantilever diaphragms to together act on the cantilever diaphragms, thereby improving the linearity of the sound production device.

An apparatus includes a vibration member, a housing at a rear surface of the vibration member, a connection member between the vibration member and the housing, and a vibration apparatus configured to vibrate the vibration member, the vibration member includes at least one flat portion and at least one flexural portion adjacent to the at least one flat portion.

An apparatus may include a vibration member and a vibration apparatus provided at a rear surface of the vibration member to vibrate the vibration member. The vibration apparatus may include at least one or more first vibration portions and a plurality of second vibration portions different from the at least one or more first vibration portions. The at least one or more first vibration portions may be at a periphery of, or may be adjacent to, the plurality of second vibration portions.

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

A method of forming a device having a compliant member includes creating a membrane having one or more elastomeric layers which are at least partially cured. Another elastomeric layer is provided on the membrane in an uncured state. At least one of a bobbin and a housing are positioned so that an end of the bobbin or housing, or the ends of both the bobbin and housing, extend at least partially into the uncured elastomeric layer. The uncured elastomeric layer is then cured to secure it to the membrane and to the housing or bobbin, or both the housing and bobbin. The method substantially reduces or eliminates the formation of holes that can form during fabrication or use of the device.

A method of forming a device having a compliant member includes creating a membrane having one or more elastomeric layers which are at least partially cured. Another elastomeric layer is provided on the membrane in an uncured state. At least one of a bobbin and a housing are positioned so that an end of the bobbin or housing, or the ends of both the bobbin and housing, extend at least partially into the uncured elastomeric layer. The uncured elastomeric layer is then cured to secure it to the membrane and to the housing or bobbin, or both the housing and bobbin. The method substantially reduces or eliminates the formation of holes that can form during fabrication or use of the device.

The present application relates to graphene-based transducing devices, including micromechanical ultrasonic transducers and electret transducers. A micromachined ultrasonic transducer comprising: a backing layer, a spacer layer, and a diaphragm comprising a material selected from the group consisting of graphene, h-BN, MoS2, and combinations thereof, wherein the backing layer comprises a first etched semiconductor, glass, or polymer, wherein the spacer layer comprises a second etched semiconductor, glass, or polymer.

The present application relates to graphene-based transducing devices, including micromechanical ultrasonic transducers and electret transducers. A micromachined ultrasonic transducer comprising: a backing layer, a spacer layer, and a diaphragm comprising a material selected from the group consisting of graphene, h-BN, MoS2, and combinations thereof, wherein the backing layer comprises a first etched semiconductor, glass, or polymer, wherein the spacer layer comprises a second etched semiconductor, glass, or polymer.