Provided is a mounting component held so as to be capable of attachment and detachment by a mounting machine. The mounting component includes a membrane support, a vibrating membrane connected to the membrane support and displaceable in a membrane thickness direction, and a contact member that is located on the membrane support and is subjected to an upward attractive force by the mounting machine without generating stress leading to shape deformation or breakage of the vibrating membrane during the attachment and detachment.

A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.

Display panel and display apparatus including the same. A display panel includes a first substrate including a display portion configured to display an image, a second substrate attached to the first substrate by an adhesive member, and a vibration generating module within the adhesive member to overlap the display portion. The vibration generating module is surrounded by the second substrate and the adhesive member.

A display device including a display panel including a first substrate and a pixel array layer disposed on a first surface of the first substrate, a first sound generation device disposed on a second surface of the first substrate opposing the first surface, and configured to vibrate the display panel and output first sound, and a circuit board disposed on the second surface of the first substrate, in which the first sound generation device includes a bobbin fixed on one surface of the first substrate, a voice coil surrounding a side surface of the bobbin, a magnet disposed on the bobbin and spaced apart from the bobbin, and a plate disposed on the magnet and fixed to the circuit board.

The present disclosure provides a reinforcing part for a speaker diaphragm, a diaphragm and a speaker. The reinforcing part is an overlapped three-layer structure and comprises a support layer as well as a first heat dissipation layer and a second heat dissipation layer that are fixed and bonded on surfaces of two sides of the support layer respectively, the support layer comprises through holes penetrating surfaces of two sides thereof, and the reinforcing part further comprises fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.

The present disclosure provides a diaphragm and a sound generating device using the diaphragm. The diaphragm comprises a diaphragm body part, and a composite layer bonded to the center of the diaphragm body part. The composite layer comprises: a porous material layer; and a first metal layer and a second metal layer respectively disposed on two sides of the porous material layer. Compared with the prior art, the composite layer of the diaphragm adopts a composite structure composed of a porous material layer and metal layers, which can reduce the mass of the diaphragm and improve the modulus density ratio of the diaphragm while ensuring the rigidity of vibration. The porous structural material can increase the damping of the diaphragm, absorb the vibration energy under the specific resonant frequency, and thus effectively improve the high-frequency split vibration, reduce the distortion and improve the high pitched sound quality.

Aspects of the subject technology relate to a device comprising a moving-coil speaker including a diaphragm to play low-frequency signals from an audio-signal source, and a piezoelectric transducer coupled to the diaphragm to play high-frequency signals from the audio-signal source. A coupler couples the diaphragm to a housing of the device.

A piezoelectric microelectromechanical systems device can include a cavity bounded by walls and an asymmetrical bimorph structure at least partially spanning the cavity that includes at least a piezoelectric layer and two electrode layers. The electrode layers can have relative thicknesses configured to compensate for expected temperature stress in the bimorph structure. Thus, metals having different thicknesses can be positioned and configured to compensate deflection due to thermal stress of any or all of the piezoelectric layer, the first metal layer, and second metal layer and a substrate. A method for making the piezoelectric microelectromechanical systems device is also provided.

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.