An electrically heating support includes: a pillar shaped honeycomb structure including: an outer peripheral wall; and a partition wall disposed on an inner side of the outer peripheral wall, the partition wall defining a plurality of cells, each of the plurality of cells extending from one end face to the other end face to form a flow path; and a pair of electrode layers disposed so as to face each other across a central axis of the honeycomb structure, each of the electrode layers being disposed on a surface of the outer peripheral wall of the honeycomb structure; and a metal terminal provided on each of the electrode layers. The honeycomb structure includes a ceramic having a PTC property, and the electrode layers include a ceramic having an NTC property.

A honeycomb structure including a honeycomb having porous partition walls extending between inflow and outflow end faces to define cells, an outermost peripheral wall, and a pair of electrodes disposed on a side surface of the honeycomb. Each electrode is formed in a strip shape extending in a direction of the cells. In a cross section orthogonal to the extending direction of the cells, one electrode is disposed on a side opposed to the other electrode. The honeycomb has an outer peripheral region including the outer peripheral wall, a central region, and an intermediate region. An average electric resistivity A of a material constituted of the outer peripheral region, an average electric resistivity B of a material constituted of the central region and an average electric resistivity of C of a material constituted of the intermediate region satisfy the relationship: A≤B<C.

The disclosure relates to a heater made from a layer of silicone rubber or similar material having one or more embedded heating elements and a conductive plate such as an aluminum plate positioned on a side of the layer of silicone rubber. The heater can be used to heat fluids necessary to generate a peritoneal dialysis fluid or heat peritoneal dialysis fluid prior to infusion into a patient. Systems that have one or more of the heaters of the invention to generate the peritoneal dialysis fluid and to heat the generated peritoneal dialysis fluid are provided.

A trench heater includes a case, a connecting unit, and a sub-assembly unit. The sub-assembly unit includes a baffle, a first junction panel, a second junction panel, and an electrical heating unit. The electrical heating unit includes a heating unit that comprises a heating element, a body, and a granular heat transfer medium. Multiple trench heaters may be connected end to end to create longer lengths via a modular platform.

A vapor generation device and an infrared emitter is provided. The vapor generation device includes a housing, where the housing is internally provided with: a cavity, configured to receive an inhalable material; an infrared emitter, including an infrared emission material, where the infrared emission material is configured to heat the inhalable material by radiating an infrared ray; a temperature sensing material, formed on the infrared emitter and insulated from the infrared emission material, where the temperature sensing material has a positive or negative resistance-temperature coefficient; and a circuit, configured to obtain a resistance value of the temperature sensing material and determine a temperature of the infrared emitter from the resistance value. The temperature of the infrared emitter can be determined by printing or depositing a temperature sensing material with a temperature sensor function on the infrared emitter itself and detecting the resistance of the temperature sensing material.

Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.

A heater includes a metal base, having an inner surface and an outer surface; an oxide film, formed by oxidization on the inner surface of the metal base, the oxide film being configured to generate infrared rays and at least radiatively heat an aerosol generation substrate; and a heating body, provided on the outer surface of the metal base, the heating body being configured to receive electric power from a power supply to generate heat, and transfer the heat to the oxide film such that the oxide film is heated by the heat and the temperature thereof rises, to generate infrared rays. According to the present application, the heating body is adopted to heat the oxide film formed by oxidization on the surface of the metal base, such that the oxide film generates infrared rays to radiatively heat the aerosol generation substrate.

A method for producing an electromigration-resistant crystalline transition-metal silicide layer of a layer sequence, for example, to provide a micro heater includes, supplying a semiconductor substrate including an electrically insulating layer; physically depositing a transition metal on the electrically insulating layer; carrying out a plasma-enhanced chemical vapor deposition while forming an inert gas plasma; conveying monosilane to the inert gas plasma, with the monosilane decomposing into silicon and hydrogen and the silicon in the gaseous phase entering into a chemical reaction with the transition metal in order to form the electromigration-resistant crystalline transition-metal silicide layer.

A thermal emitter includes a freestanding membrane supported by a substrate, wherein the freestanding membrane includes in a lateral extension a center section, a conductive intermediate section and a border section, wherein the conductive intermediate section laterally surrounds the center section and is electrically isolated from the center section, the conductive intermediate section including a conductive semiconductor material that is encapsulated in an insulating material, wherein the border section at least partially surrounds the intermediate section and is electrically isolated from the conductive intermediate section, and wherein a perforation is formed through the border section.

A heater includes a base body, a conductive module, and an infrared electrothermal coating. The conductive module includes a first electrode and a second electrode spaced on the base body. The first electrode includes a first bar electrode axially extending from a first end to a second end, the second electrode includes a second bar electrode axially extending from the first end to the second end, and at least a part of the infrared electrothermal coating is located between the first bar electrode and the second bar electrode. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the first end is less than an equivalent resistance of a middle part of the infrared electrothermal coating. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the second end is less than the equivalent resistance of the middle part of the infrared electrothermal coating.