Described herein is an automotive sheet heater. The automotive sheet heater includes a stacked structure of a far-infrared radiating layer, a metal layer, and a metal wire-containing carbon nanotube heating layer. The carbon nanotube heating layer includes 1 wt % to 50 wt % of metal wires.

A heating element includes a matrix; and a plurality of conductive fillers, wherein some of the plurality of conductive fillers include first nano-sheets and first metal media configured to reduce a contact resistance between the first nano-sheets.

An object of the disclosure is to provide a heat generation element having high durability and a method of manufacturing the same. A heat generation element 1 according to the disclosure includes a first layer 2 having a metallic tantalum phase, and a second layer 3 which covers a periphery of the first layer 2 and has a tantalum carbide phase, wherein a concentration of silicon in an interface portion 4 between the first layer 2 and the second layer 3 is higher than a concentration of silicon in a portion other than the interface portion 4.

An object of this invention is to provide a MoSi.sub.2 heater capable of preventing the peeling of the metal film formed on an electrode part, and thereby extending the service life of the heater. A MoSi.sub.2 heater comprising a heat generating part, a terminal part, and an electrode part provided to a part of the terminal part, wherein the electrode part includes a metal film, and an oxide film having a film thickness of 2.5 m or less is provided between the metal film and a MoSi.sub.2 base material.

A flexible heat preservation board with heating wire encapsulated therein includes a heating pad, a heating wire and a liquid adhesive. A first side of the heating pad is defined with a groove and arranged with a plurality of projections. The heating pad is provided with a power supplier. Inner surfaces of the groove are provided with a first protrusion and a second protrusion respectively. A bottom surface of the groove, lower surfaces of the first protrusion and the second protrusion define an open accommodating space for receiving the heating wire. A first gap is formed between the first protrusion and the heating wire, a second gap is formed between the second protrusion and the heating wire. The liquid adhesive encapsulates the first protrusion, the second protrusion, and the heating wire in the groove. Both the heating pad and the heating wire are flexible.

A method of healing a plurality of non-volatile semiconductor memory devices on a multi-chip package is disclosed. The multi-chip package can be heated to a temperature range having a temperature range upper limit value and a temperature range lower limit value. The temperature of the multi-chip package can be kept essentially within the temperature range for a predetermined time period by monitoring a thermal sensing element with a sensing circuit outside of the multi-chip package. The thermal sensing element may be located near the components with the lowest failure temperature to ensure the multi-chip package is not damaged during the healing process.

A honeycomb structure made of ceramics, wherein the honeycomb structure includes: a borosilicate; and silicon particles doped with at least one dopant, the dopant is a Group 13 element or a Group 15 element, the silicon particles have a dopant amount (A) of 110.sup.16 to 510.sup.20/cm.sup.3, and the honeycomb structure has a silicon particle content (B) of 30 to 80% by mass.

A heat system for heating an oil within an atomizer includes a power source having one or more controls to activate energy transmission from the power source; a connection to electrically connect to the power source; an electrical connection to engage with the connection for receiving energy therefrom; a heat bucket to hold the oil for heating; the heat bucket is connected to the electrical connection to receive energy therefrom; and the heat bucket is to heat up such that the oil is heated.

In accordance with an embodiment, a method for operating a thermal emitter having an electrically conductive semiconductor section includes: providing during an operational cycle, an activation signal having a first energy level to the electrically conductive semiconductor section of the thermal emitter for emitting infrared (IR) radiation; and providing, during a refresh cycle, a refresh signal having a second energy level to the electrically conductive semiconductor section of the thermal emitter, where the second energy level is different from the first energy level.

A method of healing a plurality of non-volatile semiconductor memory devices on a multi-chip package is disclosed. The multi-chip package can be heated to a temperature range having a temperature range upper limit value and a temperature range lower limit value. The temperature of the multi-chip package can be kept essentially within the temperature range for a predetermined time period by monitoring a thermal sensing element with a sensing circuit outside of the multi-chip package. The thermal sensing element may be located near the components with the lowest failure temperature to ensure the multi-chip package is not damaged during the healing process.