In a method for operating a heating device, fluid is initially introduced into a fluid chamber, then the heating elements of the heating device are switched on and a leakage current is detected as a temperature-dependent current flow through a dielectric insulation layer. A supply voltage of the heating devices is measured and is taken into account in an evaluation of the temperature at the fluid chamber as a function of the leakage current. The leakage current is converted into a leakage voltage by means of a resistor, which is then divided by the measured supply voltage. Subsequently, the quotient obtained may be multiplied by a compensation value in order to obtain a normalized leakage signal, which is normalized to a base value of the supply voltage. The normalized leakage signal is used, if a particular absolute value of the leakage signal is exceeded or if a particular slope of the profile of the leakage signal is exceeded, in order to top up the fluid chamber with more fluid and/or to reduce the heating power of at least one heating element.

The present disclosure provides a precursor solution of a semiconductor electrothermal film, which comprises component A, component B, and component C. The component A comprises the following components by weight: 2-10 parts of tin tetrachloride pentahydrate, 3-6 parts of stannous chloride and 0.3-1 part of glycerol, also comprises a pH regulator, the pH of the component A is 4.7-6.2; the component B comprises the following components by weight: 5-10 parts of conductivity regulator, the conductivity regulator is selected from a group consisting of antimony trichloride dihydrate, bismuth trioxide, aluminum oxide and thallium dioxide, 0.6-1 part chlorinated aluminum and a mixture thereof, also comprises a pH regulator, the pH of the component B is 4.7-5.0; the component C comprises the following components by weight: 0.5-0.7 parts of tin oxide, 0.8-1.5 parts of bismuth oxide and 15-25 parts of ethanol; also comprises 15-30 parts of distilled water. A preparation method of electrothermal film and electrothermal structure is further provided. The obtained semiconductor electrothermal film has good nature of resistance to sudden temperature changes, good temperature stability, attenuation resistance, fast heating speed, and high temperature resistance.

The invention relates to an electronic cigarette, an atomizer and a heating assembly thereof, wherein the heating assembly is used for the atomizer and includes an adsorption member, and at least one heating element for generating heat when electrified. The adsorption member comprises at least one surface defining at least one fixing groove therein, and the at least one heating element is disposed in the at least one fixing groove. The heating element is disposed in the fixing groove, so that the aerosol-generating substrate on the adsorption member can be more sufficiently coated on the heating element and dispersed to an outer surface of the heating element, preventing dry burning on the surface of the heating element; moreover, the amount of the aerosol-generating substrate heated and atomized by the heating element is increased, and so does the amount of aerosol generated by the heating element.

A heating apparatus, a non-combusted heating device and a method for manufacturing the same are disclosed. In certain aspects, the heating apparatus includes a casing with an end for receiving a product to be heated, a heating element at least partially disposed within the casing, and an insulation layer formed between an internal surface of the casing and an external surface of the heating element. The insulation layer includes a polycrystalline material having a valve metal oxide.

A heater includes a substrate, a first heating element and a second heating element disposed on a first surface of the substrate, a temperature detection element, and a conductor. The temperature detection element is disposed on a second surface of the substrate opposite the first surface of the substrate. The conductor is disposed on the second surface and connected to the temperature detection element. The first heating element has a first distance from the temperature detection element in a lateral direction of the substrate orthogonal to a longitudinal direction of the substrate, and the second heating element has a second distance that is greater than the first distance from the temperature detection element in the lateral direction. As viewed in a thickness direction of the substrate orthogonal to the lateral direction and the longitudinal direction of the substrate, the conductor overlaps the first heating element and the second heating element.

An electric heater includes a substrate (an insulating material capable of forming a conductor pattern on a surface of an insulating substrate), a first plane heating element formed on one surface of the substrate, and a second plane heating element formed on one surface of the substrate to be located outside the first plane heating element. The first plane heating element includes a first pattern portion connecting a start point with an end point located in a first zone, a pair of first electrodes located outside the first zone, and a pair of first connectors connecting the first pattern portion with the first electrodes. The second plane heating element includes a second pattern portion located in a second zone surrounding the first zone and connecting a start point with an end point, and at least some of the first connectors are located in the second zone.

An electric heater includes a substrate (an insulating material capable of forming a conductor pattern on a surface of an insulating substrate), a first plane heating element formed on one surface of the substrate, and a second plane heating element formed on one surface of the substrate to be located outside the first plane heating element. The first plane heating element includes a first pattern portion connecting a start point with an end point located in a first zone, a pair of first electrodes located outside the first zone, and a pair of first connectors connecting the first pattern portion with the first electrodes. The second plane heating element includes a second pattern portion located in a second zone surrounding the first zone and connecting a start point with an end point, and at least some of the first connectors are located in the second zone.

A heating body includes: a substrate; a heating layer arranged on the substrate; and a protruding structure layer arranged on the heating layer. The protruding structure layer includes a plurality of protruding units arranged on the heating layer at intervals or the protruding structure layer has a grid shape. In an embodiment, the heating body further includes: an insulating and heat-conducting layer arranged between the protruding structure layer and the heating layer.

An electronic vaping device includes a housing, a planar heater, a heater support, a tank, and a wick. The housing extends in a longitudinal direction and has a tip end and a mouth-end. The tip end is closed and the mouth-end has an opening therein. The heater support supports the planar heater. The tank contains a pre-vapor formulation and is configured to slide into and out of the opening of the mouth-end of the housing. The wick extends from the tank and is configured to be in contact with the planar heater when the tank is inserted in the housing.

The present disclosure discloses a transmission electron microscope in-situ chip and a preparation method thereof. The transmission electron microscope in-situ chip includes a transmission electron microscope high-resolution in-situ gas phase heating chip, a transmission electron microscope high-resolution in-situ liquid phase heating chip and a transmission electron microscope in-situ electrothermal coupling chip. The transmission electron microscope high-resolution in-situ gas phase heating chip and the transmission electron microscope high-resolution in-situ liquid phase heating chip are respectively suitable for gas samples and liquid samples, and the transmission electron microscope in-situ electrothermal coupling chip realizes the multi-functional embodiment of electrothermal coupling. The three transmission electron microscope in-situ chips have the advantages of high resolution and low sample drift rate.