A ceramic vaporization core includes: a porous body; and a heating body disposed on the porous body. The porous body includes at least one porous ceramic layer doped with a hydroxyl group-containing matrix. In an embodiment, the porous ceramic layer doped with the hydroxyl group-containing matrix includes components in parts by weight as follows: 35 to 55 parts by weight of a ceramic powder doped with a hydroxyl group compound; and 25 to 45 parts by weight of a pore-forming agent.

A sheet-shaped conductive member includes a pseudo sheet structure including a plurality of conductive linear bodies arranged at a distance from each other, the conductive linear bodies each being in a wavy shape in a plan view of the sheet-shaped conductive member, the wavy shape being a shape where a second wave is made along an imaginary first wave, the second wave being shorter in amplitude and wavelength than the first wave.

A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.

Structures (2, 2A to 2P) according to the present disclosure have respective bases (10, 10A), electrode layers, and terminals. The bases (10, 10A) are made of a ceramic. The electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) are located inside the respective bases (10, 10A). The terminals (41, 41G, 41H, 41I, 41J, 41K, 41L) are electrically connected to the respective electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) at respective tip portions of the terminals. Further, the terminals (41, 41G, 41H, 41I, 41J, 41K, 41L) are in contact with the respective electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) at respective tip surfaces and side surfaces of the terminals.

An electric heater includes a substrate and an inner plane heating element formed on one surface of the substrate. The inner plane heating element includes an inner pattern portion connecting a start point with an end point. The inner pattern portion includes a first track, a second track located outside the first track and spaced part from the first track, a first bridge connecting the first track with one end of the second track, a third track located outside the second track and spaced apart from the second track, and a second bridge connecting the other end of the second track with the third track. A first gap G1 between the first and second tracks is shorter than a second gap G2 between the second and third tracks along a virtual line crossing the first, second and third tracks and closer to the first bridge than the second bridge.

A heater assembly for an aerosol-generating system includes a perforated glass substrate and a heater element. The heater element is provided in or on the glass substrate.

The present invention relates to a personal electronic delivery system and a method for delivering a delivery fluid to a person. The system according to the invention comprises: a housing having a first end with an inlet (12) and a second end with an outlet (38); a fluid path substantially extending between the inlet and the outlet; a buffer (30) for holding a delivery fluid, and connecting means configured to transfer delivery fluid to the fluid path; and a heater (32) that is provided in, at or close to the fluid path configured for heating the delivery fluid such that at least a part of the delivery fluid atomizes and/or vaporizes in the fluid path, and an energy source (18) configured for providing energy to the heater,

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

An exhaust gas heater for an exhaust system of an internal combustion engine includes a carrier arrangement and a heating conductor arrangement supported on the carrier arrangement. The heating conductor arrangement has at least one heating conductor wherethrough current flows. The at least one heating conductor is supported with respect to the carrier arrangement by at least one connecting element. At least one length compensation arrangement has a first length compensation element, which has a first supporting surface providing a wedge formation, and has a second length compensation element, which has a second supporting surface supported on the first supporting surface and provides a counter-wedge formation. The length compensation arrangement is provided in association with the at least one connecting element. The first length compensation element and the second length compensation element have materially different coefficients of thermal expansion.

A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.