Patent classifications
H05B3/283
Porous Heating Element With Embedded Temperature Sensor And A Vaporizer Cartridge Having A Porous Heating Element With Embedded Temperature Sensor
A heating element for use in an electronic vaporizer includes a heating element base formed from a solid porous material and having an internal face and external face, a heating circuit having first and second heating electrode connections and being encapsulated within the heating element base, the heating circuit including the first and second heating electrode connections being located in a first plane, and a temperature sensing circuit having first and second temperature electrode connections and being encapsulated within the heating element base, wherein the first and second temperature electrode connections being located in a second plane, the first and second planes being spaced apart a predefined distance and being parallel to the internal face and the external face, the heating element base including the four apertures through one of the sides of the heating element base, the four apertures being configured to receive electrical wires, wherein one of the first and second heating electrode connections and first and second temperature electrode connections are aligned and accessible via a first one of the four of apertures.
HEATING MEMBER AND SUBSTRATE TREATING APPARATUS
The inventive concept relates to a heating member for heating a substrate. In an embodiment, the heating member includes a heater plate having at least one heating element bonded thereto, a connecting plate having a first space formed therein in which the heating element is accommodated, and a control plate having a control element bonded thereto, the control element being electrically connected with the heating element to control the heating element.
Wafer support table
A wafer support table includes a ceramic base and a rod. The ceramic base has a wafer placement surface and includes an RF electrode and a heater electrode that are embedded therein in the mentioned order from the side closer to the wafer placement surface. A hole is formed in the ceramic base to extend from a rear surface toward the RF electrode. The rod is made of Ni or Kovar, is bonded to a tablet exposed at a bottom surface of the hole, and supplies radio-frequency electric power to the RF electrode therethrough. An Au thin film is coated over a region of an outer peripheral surface of the rod ranging from a base end of the rod to a predetermined position.
RADIATING PANEL
A radiating panel includes the following succession of layers: at least one supporting layer which is at least thermally insulating and constituted by a material chosen from extruded expanded polystyrene, sintered expanded polystyrene, and polyisocyanurate; at least one heating layer which includes at least one electric heating element and a studded element with interspaces for laying at least one electric heating cable. The studded element has a shaped sheet element with studs extending in the opposite direction to that of the supporting layer.
The panel includes at least one finishing layer which is at least thermally conducting and made of a material chosen at least from ceramic and natural stone.
The panel also includes an adhesive between the heating and finishing layers, and the studded element is coupled to the supporting layer using one element chosen from glue, extruded adhesives, silicone glues, pressure-sensitive adhesive systems, and mechanical fixing elements.
PLASMA PROCESSING APPARATUS, AND TEMPERATURE CONTROL METHOD
A plasma processing apparatus includes a stage having a placing surface on which a workpiece is accommodated; a heater provided in the stage and configured to adjust a temperature of the placing surface of the stage; and a controller. The controller is configured to control a supply power to the heater; measure the supply power in a transient state where the supply power to the heater increases and in a second steady state where the supply power to the heater is stable in an extinguished state of plasma; calculate a heat input amount and a heat resistance by performing a fitting on a calculation model that calculates the supply power in the transient state using the heat input amount from the plasma and the heat resistance between the workpiece and the heater as parameters; and calculate a temperature of the workpiece in the first steady state.
SEGMENTED THERMORESISTIVE HEATING SYSTEM
An electric cooking appliance includes a glass-ceramic substrate having a top surface for supporting cookware for heating thereon, and a bottom surface opposite the top surface. The electric cooking appliance includes a plurality of thermoresistive heating elements disposed and spaced apart on the bottom surface of the glass-ceramic substrate, with each of the plurality of thermoresistive heating elements including graphene nanoparticles embedded in a ceramic matrix for generating heat upon application of electric current to the respective thermoresistive heating element. Each thermoresistive heating element is electrically connected to a power supply such that one or more of the plurality of thermoresistive heating elements are selectively activated to receive electric current to heat localized areas of the glass-ceramic substrate.
Heating arrangement for bonding a protective shell to a wind turbine blade and method for bonding a protective shell to a wind turbine blade
Providing is a heating arrangement for bonding a protective shell to a wind turbine blade, including a heating blanket with a first portion and a second portion of a heatable structure, wherein the first portion and the second portion adjoin at a fold of the heating blanket, wherein the fold is curved equally or substantially equally to a curvature of an edge of the wind turbine blade or of a segment of an edge of the wind turbine blade, wherein the heating blanket is mountable to a surface of the wind turbine blade in such manner that the fold abuts the edge or the segment of the edge and that the first portion and the second portion each abuts the surface of the wind turbine blade.
STRUCTURAL BODY AND HEATING APPARATUS
A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.
STRUCTURE AND HEATING DEVICE
Structures (2, 2A to 2P) according to the present disclosure have respective bases (10, 10A), electrode layers, and terminals. The bases (10, 10A) are made of a ceramic. The electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) are located inside the respective bases (10, 10A). The terminals (41, 41G, 41H, 41I, 41J, 41K, 41L) are electrically connected to the respective electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) at respective tip portions of the terminals. Further, the terminals (41, 41G, 41H, 41I, 41J, 41K, 41L) are in contact with the respective electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) at respective tip surfaces and side surfaces of the terminals.
Ceramic device
The invention provides a ceramic device enabling more complex, elaborate patterns for resistance heating elements or electrodes. A ceramic device includes a ceramic substrate consisting of a ceramic sintered body and including at least a base layer, an intermediate layer laminated over the base layer, and an overlayer laminated over the intermediate layer; and an electrifiable resistance heating element or electrode having a predetermined pattern extending in a planar shape and being embedded in the ceramic substrate. A horizontal surface is defined in the upper surface of the intermediate layer, along which the resistance heating element or electrode is arranged, and the overlayer is laminated onto the upper surface of the intermediate layer to cover the resistance heating element or electrode.