A heater assembly for an aerosol-generating system includes a perforated glass substrate and a heater element. The heater element is provided in or on the glass substrate.

A wafer placement table includes a conductor unit. In the wafer placement table, a sub-RF electrode (first conductive layer) and a jumper layer (second conductive layer) are embedded at different levels in a ceramic substrate having a wafer placement surface, and the conductor unit establishes electrical continuity between the sub-RF electrode and the jumper layer. The conductor unit is a transversely placed coil or a transversely placed perforated cylindrical body.

A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.

A wafer placement table includes a ceramic substrate having a wafer placement surface; a first electrically conductive layer embedded in the ceramic substrate; and an electrically conductive via connected at one end to the first electrically conductive layer, wherein the electrically conductive via includes a plurality of columnar members connected together in a vertical direction, and wherein the area of the connection surface of one of two columnar members connected to each other is larger than the area of the connection surface of the other.

There is provided a substrate holder including: a ceramic base member; electrodes embedded in the ceramic base member; at least one conductive member embedded in the ceramic base member; connecting parts each of which has an end electrically connected to one of the electrodes; a land electrically connected to the at least one conductive member; and terminals each of which has an end connected to one of the electrodes, the at least one conductive member or the land. A resistance value between a connecting part, included in the connecting parts and connected to the at least one conductive member, and a terminal, included in the terminals and connected to the at least one conductive member is smaller than a resistance value between both ends of each of the electrodes; and the number of the terminals is smaller than two times the number of the electrodes.

A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:— a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact; b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact; c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly; d) isostatically pressing the laminated assembly to form a pressed laminated assembly; e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.

A method for producing a heater with a co-sintered multilayer construction for a system for providing an inhalable aerosol, including providing at least one first substrate layer, arranging at least one first insulating layer at least in areas on the first substrate layer, arranging at least one heating element at least in areas on the first insulating layer, arranging at least one second substrate layer and at least one second insulating layer at least in areas on the heating element. The second insulating layer is arranged at least in areas on the second substrate layer, and the second insulating layer is in contact at least in areas with the heating element and/or with the first insulating layer. The method includes pressing the layers and the heating element, and firing the pressed layers in order to co-sinter the layers of the multilayer construction.

We disclose a micro-hotplate comprising a substrate comprising an etched portion and a substrate portion and a dielectric region over the substrate. The dielectric region comprises first and second portions. The first portion is adjacent to the etched portion of the substrate and the second portion is adjacent to the substrate portion of the substrate. The micro-hotplate further comprises a heater formed in the dielectric region, and a ring structure formed within and/or over the dielectric region such that the ring structure is coupled with the first and second portions of the dielectric region.

An electrostatic chuck heater 10 includes a disc-shaped ceramic base 30 and a plurality of heating elements 20 embedded in the ceramic base 30. A top surface 12 of the electrostatic chuck heater 10, which serves as a wafer Mounting surface, is divided into multiple zones. The heating elements 20, which each include terminals 22 and 24, are embedded in the ceramic base 30 in the respective zones. Terminal collection regions 16 are provided on a bottom surface 14 of the electrostatic chuck heater 10. The number of terminal collection regions 16 (eight in this example) is smaller than the total number of heating elements 20. The terminals 22 and 24 of each of the heating elements 20 are connected to one of the terminal collection regions 16 through the ceramic base 30.

A method of making a heater includes an aluminum nitride base having equal to or less than 1% impurities, particularly one embodiment having none of polybrominated biphenyl, polybrominated diphenyl ether, hexabromocyclododecane, polyvinyl chloride, chlorinated paraffin, phthalate, cadmium, hexavalent chromium, lead, and mercury. The base is fired in a heating unit before any layering. Thereafter, on a topside and backside of the base a conductor layer is layered and allowed to settle and dry before firing. Next, a resistive layer is layered on the base from a resistor paste such that the resistive layer connects to the conductor layer on the topside. The resistor paste is allowed to settle and dry and then the base with the conductor and resistor layers is fired. At least four layers of glass are layered next over the resistive layer, each instance thereof including layering a glass, drying the glass and firing.