A power semiconductor module includes a first substrate, wherein the first substrate includes aluminum, a first aluminum oxide layer arranged on the first substrate, a conductive layer arranged on the first aluminum oxide layer, a first semiconductor chip, wherein the first semiconductor chip is arranged on the conductive layer and is electrically connected thereto, and an electrical insulation material enclosing the first semiconductor chip, wherein the first aluminum oxide layer is configured to electrically insulate the first semiconductor chip from the first substrate.

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

A system for driving power devices is provided, and the system includes a heat dissipation plate, semiconductor modules, gate plates, a control board, a bridge module, and a terminal module. The semiconductor modules are disposed on the heat dissipation plate. Each gate plate is disposed on the corresponding semiconductor module and includes first driving terminal. The control board is disposed on the heat dissipation plate. The bridge module and the terminal module are electrically connected to each other, disposed on the control board, and arranged sequentially in a direction from a center to an edge of the control board. The bridge module includes a plurality of driving bridge plates, and each driving bridge plate is electrically coupled to the control board. The terminal module includes a plurality of second driving terminals, and each second driving terminal is electrically connected to the corresponding driving bridge plate and first driving terminal.

System, methods, and other embodiments described herein relate to using a printed conductor and a rectifier in the same enclosure for transferring power. In one embodiment, an apparatus includes a conductor, printed on a substrate housed in an enclosure, that generates alternating current caused by a magnetic field emitted by a transmitter, wherein the conductor is a trace spanning layers. The apparatus also includes a rectifier, on a device housed in the enclosure, that receives the alternating current through a terminal connected with the conductor and converts the alternating current to a direct current for powering a load, wherein an insulator between the conductor and the rectifier isolates the magnetic field.

A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).

A manipulator arm for a robot, including a printed circuit board motor and a transmission, the printed circuit board motor including a multi-layer board having at least one first solenoid coil with flat coils lying vertically on top of each other, the flat coils being connected electrically in series or in parallel, two vertically adjacent coils being orthogonally offset to each other in each case such that, in a cross-section perpendicular to the surface of the multi-layer board, conducting track portions of the one flat coil are arranged in partial overlap vertically with two conducting track portions of the other flat coil. A robot having at least one manipulator arm of this type and the use of a printed circuit board motor in a manipulator arm of a robot are also provided.

An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer , which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.