A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

Monolithic power stage (Pstage) packages and methods for using same are provided that may be implemented to provide lower thermal resistance/enhanced thermal performance, reduced noise, and/or smaller package footprint than conventional monolithic Pstage packages. The conductive pads of the disclosed Pstage packages may be provided with a larger surface area for contacting respective conductive layers of a mated PCB to provide a more effective and increased heat transfer away from a monolithic Pstage package. In one example, the increased heat transfer away from the monolithic Pstage package results in lower monolithic Pstage package operating temperature and increased power output. In another example, a monolithic Pstage package may be provided with an adaptive application-oriented interface and a multi-function pin that allows the same monolithic Pstage package to automatically detect and select between a relatively higher power information handling system application, and a relatively lower power information handling system VR application.

A radar system includes two circuit boards, a first carries an array of antenna elements and the second carries power circuitry to power the circuitry of the first board. To provide adequate cooling whilst minimising the size of the system the two circuit boards are mounted in a sandwich arrangement on opposite sides of a heat sink. Data and power connections between the two boards are provided by a plurality of electrical cables that extend through apertures in the heat sink.

An apparatus for a (non-combustible) aerosol generating device is described comprising: a resonant circuit comprising one or more inductive elements for inductively heating a susceptor arrangement to heat an aerosol generating material to thereby generate an aerosol, wherein the inductive elements are mounted on a first external surface of a substrate; a switching arrangement for enabling an alternating current to be generated from a voltage supply and flow through one or more of said inductive elements to cause inductive heating of the susceptor arrangement, wherein the switching arrangement comprises a plurality of transistors mounted to a second external surface of the substrate; and a heat sink, wherein the inductive elements of the resonant circuit and the transistors of the switching arrangement are thermally connected to the heat sink.

Semiconductor device assemblies are provided with a package substrate including one or more layers of thermally conductive material configured to conduct heat generated by one or more of semiconductor dies of the assemblies laterally outward towards an outer edge of the assembly. The layer of thermally conductive material can comprise one or more allotropes of carbon, such as diamond, graphene, graphite, carbon nanotubes, or a combination thereof. The layer of thermally conductive material can be provided via deposition (e.g., sputtering, PVD, CVD, or ALD), via adhering a film comprising the layer of thermally conductive material to an outer surface of the package substrate, or via embedding a film comprising the layer of thermally conductive material to within the package substrate.

A laminated substrate that includes a substrate body having a plurality of laminated ceramic layers containing a first glass; a wiring conductor within the substrate body and made from silver, copper, a silver alloy, or a copper alloy; and a thermal conductor within or on a main surface of the substrate body. The thermal conductor is at least one of (1) a thermal via penetrating a part of a first ceramic layer of the plurality of laminated ceramic layers in a thickness direction thereof, and (2) a heat spreader extending along a main surface of the first ceramic layer of the plurality of laminated ceramic layers. A first thermal conductivity of the thermal conductor is higher than a second thermal conductivity of the first ceramic layer, and the thermal conductor contains an insulating ceramic as a main material thereof, and further contains a second glass.

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

A control device for a motor vehicle is provided. The control device includes a printed circuit board having a first side and an edge. The first side of the printed circuit board is delimited by the edge. The control device includes at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board). The control device also includes a first conductor loop formed as a resistor and arranged on the first side of the printed circuit board. The first conductor loop is arranged between the edge and the electronic component. The control device also includes an encapsulation of the printed circuit board. The encapsulation surrounds at least the first side, the at least one electronic component and the first conductor loop.

A circuit board has a main board with a base material of insulating material, at least one metal base copper clad laminate, and each metal base copper clad laminate is provided with at least one component and a pin connected with the main board. The circuit board and the driving power supply with the circuit board have simple structure and low manufacturing cost, and are convenient for automatic manufacturing. The power device can be directly mounted on the metal substrate through the automation equipment, so that the metal substrate can realize the function of the heat sink, thereby improving the production efficiency and reducing the process quality hidden danger; at the same time, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.

An electronic controller is provided and includes a printed wiring board (PWB) on which electronics are operably disposed, a power supply configured to supply power to the electronics, a heat sink and one or more thermal conductors anchored to the PWB to assume and move between first and second connection states in first and second thermal conditions, respectively. The first connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and thermally disconnected from the heat sink. The second connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and to the heat sink.