A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a thermally-conductive stiffener, at least one wiring layer over the stiffener, and a cover film over the at least one wiring layer, where the centroid of the stiffener is offset from the centerline of the cover film. Thus, utilizing the heat-sink characteristics of the stiffener, temperature differences among the upper and lower electrical pads of the FPC resulting from a heat-based interconnection procedure can be reduced and the temperatures across the FPC finger made more uniform, damage to the FPC prevented, and soldering yields improved.

A ceiling lamp, an LED light source module, and a light source assembly are provided. The light source assembly includes a plastic heat-dissipating member and a metal substrate for mounting LED light sources of the ceiling lamp. The plastic heat-dissipating member includes an embedding groove, and the metal substrate is embedded in the embedding groove and is in contact with groove walls of the embedding groove. The light source assembly can effectively balance safety, performance and cost.

Disclosed is a packaging structure for circuit units, comprising: a circuit baseplate, wherein the circuit baseplate is provided thereon with a circuit unit, the circuit unit including a silicon dioxide layer and an electronic device arranged on the silicon dioxide layer; an insulator, wherein the insulator surrounds the circuit unit; and an electromagnetic shielding layer, wherein the electromagnetic shielding layer covers the circuit unit and the insulator.

A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling. A first conductive column of the clamp is configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead. The first conductive column extends from a load spreading plate. The load spreading plate is an insulator that electrically isolates a fastener extending therefrom from the first conductive column. The fastener is configured to cooperate with the circuit board to connect the clamp to the circuit board, compress the load spreading plate against the first conductive column to compress the first electrical connection, and connect the clamp to ground.

A driving device includes an electric motor, a rotating shaft, a motor housing, a printed circuit board, an electric power converting circuit, a rear frame end working as a heat radiating member, gel working as a heat transfer member, multiple mounted parts and so on. The heat radiating member is located on a side of the printed circuit board and facing a motor-side surface of the printed circuit board, to which multiple switching elements are mounted. The gel is plastically deformed and adhered to the switching elements and the heat radiating member for transferring heat of the switching elements to the heat radiating member. At least one of the mounted parts is mounted to the printed circuit board and located at a position between a through-hole opposing area and one of the switching elements, which is located at a position closest to a rotational angle sensor mounted to the printed circuit board in the through-hole opposing area.

Provided is a washing machine having a printed circuit board (PCB) assembly. The washing machine includes a cabinet forming an external appearance thereof, a top cover coupled to an upper side of the cabinet, and a PCB assembly provided in the cabinet and configured to control the washing machine, wherein the PCB assemble includes a frame in which a PCB is accommodated and a cover covering the PCB, and the cover includes a heat dissipation path configured to dissipate heat of the PCB and a water inflow preventer configured to prevent water from being introduced into the heat dissipation path.

Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.

A heat sink includes a heat sink fin (HSF), a first heat sink plate (HSP), and a second HSP that is opposite to the first HSP. The HSF is located on the first HSP. The second HSP is flexible. Further, an elastic component is disposed between the first HSP and the second HSP. The second HSP is in contact with a heat source component (HSC). Thus, when the heat sink is placed on the HSC, the second HSP contacts the HSC, the second HSP is deformed because the heat sink and the HSC are pressed against each other, and the elastic component between the first HSP and the second HSP is compressed such that heat generated by the HSC is transferred to the heat sink.

A power converter includes an amplifier, an inductor, a capacitor, and an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process. The interconnection block supports one of the inductor and the capacitor in a manner that the one the inductor and the capacitor is disposed vertically above an other of the inductor and the capacitor.