A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.

A power supply voltage terminal and a ground terminal having a rectangular cross section are respectively connected to a first terminal hole of a power supply pattern and a second terminal hole of a ground pattern. An inductor is surface-mounted on a substrate, and has a rectangular parallelepiped shape in which an input end connected to a power supply pattern and an output end connected to a power supply relay face each other. A first electrode terminal of a capacitor is connected to the power supply pattern, a second electrode terminal is connected to the ground pattern, and constitutes a filter circuit together with the inductor. A wall surface of an input end of the inductor is arranged parallel to the longitudinal axis direction (x direction) of the first terminal hole. The inductor opposes the first terminal hole so as to include the entire length Wh of the first terminal hole within the width Wt of the input end in the x direction.

A circuit board heat sink structure having a circuit board and comprising a metallic heat sink, wherein the circuit board has a metal substrate, an insulation layer and a conductor layer, and the wherein the circuit board is arranged on the heat sink in such a way that the metal substrate contacts a locating face of the heat sink. At least one heat transition point is formed between the heat sink and the metal substrate, which provides a defined metallic contact between the material of the heat sink and the material of the metal substrate. A method is also provided for forming the circuit board heat sink structure.

A display device includes a display panel, a data driver which transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, where a part of the metal tape overlapping the input side wiring in the plan view defines an opening.

An apparatus includes a printed circuit board (PCB), an integrated circuit (IC) component connected with a surface of the PCB, and a heat sink. The heat sink includes a base plate disposed directly over the IC component, and a plurality of cooling fins extending transversely from the base plate. The heat sink includes at least one component including a bimetallic material that distorts when heated above a threshold temperature so as to modify a flow of air directed toward and contacting the cooling fins or maintain contact between a surface of the IC component and a facing surface of the base plate.

An optical transceiver includes a housing, a heat source accommodated in the housing, and a thermal interface material accommodated in the housing. The housing is in thermal contact with the heat source through the thermal interface material, and the thermal interface material is in physical contact with an uneven surface of the housing.

A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.

A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.

A printer includes a board configured to control a printing unit operating in the printer that performs printing on a medium, and a heat sink including a counter surface that is provided to face a board surface of the board and that has a shape with a length in a first direction X longer than a length in a second direction Y intersecting the first direction X in a plan view, and configured to receive heat generated in the board with the counter surface and dissipate the heat to the outside. The counter surface includes a slit penetrating the counter surface and extending in the second direction Y.

An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.