A component carrier includes a stack having at least one horizontal electrically conductive layer structure, at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and at least one vertical via being laterally offset from the semiconductor component. The at least one horizontal electrically conductive layer structure electrically connects the vertical via to a bottom main surface of the semiconductor component. The component carrier is configured for a current flow from the vertical via to the horizontal electrically conductive layer structure, from the horizontal electrically conductive layer structure to the bottom main surface of the semiconductor component, from the bottom main surface of the semiconductor component to an upper main surface of the semiconductor component, and from the upper surface of the semiconductor component to the outside of the component carrier.

A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.

An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.

A support structure supports a component mounted on a mounting surface of a structure by pressing the component to the mounting surface side and includes a first support tool and a second support tool used so that the component is pressed to the mounting surface side and supported and a fixing portion provided on the structure and fixing the first support tool and the second support tool. The first support tool and the second support tool are fixed to the same fixing portion.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).

The application concerns a cooling arrangement for a power tool and a power tool comprising the cooling arrangement. According to an aspect of the invention a cooling arrangement for a power tool comprises a housing of the power tool and electronics. The electronics include at least one circuit board and at least one electronic component. The electronics comprise at least one heat conductive area. The at least one heat conductive area is arranged to be heat conductively connected to the housing of the power tool.

A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.