An in-vehicle electronic device includes an electronic component and a latent heat storage material. The latent heat storage material contacts the electronic component either directly or indirectly through a heat transfer member. A phase transition temperature of the latent heat storage material is between: a temperature, which is to be reached at night under a circumstance the latent heat storage material is used; and an operating upper limit temperature of the electronic component.

RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5° and 45°. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.

Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.

A lighting module for an automotive vehicle. The module comprises a support, for example made by a heat dissipation device, and a printed circuit board accommodating at least one light source of a first type. The printed circuit board is housed on the support. The lighting module proposes allowing light sources of a second type, generating, for example, a different amount of heat, to be housed so that the rays arising from the two types of sources may be coupled into one and the same light guide, while efficiently dissipating the heat generated by each of the types of light sources.

An image capture device, including: a heatsink, an integrated sensor and lens assembly (ISLA), and a battery cage. The heatsink includes a mounting flange. The ISLA extends through the heatsink. The battery cage being in communication with a finger mounting flange of the mounting flange to support the battery cage within the image capture device.

A radio frequency (RF) transistor amplifier includes a package submount. a package frame comprising an electrically insulating member and one or more conductive layers on the package submount and exposing a surface thereof, a transistor die on the surface of the package submount and comprising respective terminals that are electrically connected to the package frame, a protective member covering the transistor die, and one or more electrical components that are attached to the package frame outside the protective member. Related RF power device packages and fabrication methods are also discussed.

Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

An electronic assembly includes a printed wiring board (PWB), and a stiffener secured to the PWB. The stiffener includes one or more tray sections. One or more electronic modules is secured respectively to the one or more tray sections of the stiffener.

A medical device comprising a multilayer printed circuit board (PCB) comprising a heating element on an inner layer of the PCB; a single cell electrical power source to power the heating element; and a chamber adapted to contain a liquid, at least part of said chamber being defined by a thermally conductive material configured to provide a thermal transfer interface between the chamber and the PCB.

A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.