The present disclosure provides a display panel and a display device. The display panel includes: a base substrate including a display unit and a bendable unit, the bendable unit being connected to the display unit and bendable to a back of the display unit; a multiplexer on the bendable unit; and a metal shielding portion on a side of the multiplexer away from the base substrate, wherein an orthographic projection of the metal shielding portion on the base substrate covers an orthographic projection of the multiplexer on the base substrate, and the metal shielding portion is connected to a fixed voltage signal to shield signal interference caused by the multiplexer.

An electronic device is disclosed, including: a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface, a first printed circuit board (PCB) disposed on the first surface of the housing, a second PCB disposed on the first surface of the housing and spaced apart from the first PCB, a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB, a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB, and an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.

A printed circuit board includes a reference plane embedded in a substrate and adjacent to the top surface of the substrate. The printed circuit board also includes a first signal net and a second signal net being in close proximity to each other and disposed within a specific region on the top surface of the substrate. An outermost insulating layer on the top surface of the substrate covers the substrate, the first signal net and the second signal net, and includes an opening to expose a portion of the second signal net. A conductive layer is disposed in the opening and on the outermost insulating layer corresponding to the specific region, such that the conductive layer overlaps with the first signal net. A fifth signal net is embedded in the substrate and between the reference plane and the outermost insulating layer.

An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.

A printed circuit board of an information handling system includes a dielectric layer, adjacent differential pairs, a ground layer, and a ground wall. The adjacent differential pairs are plated on the dielectric layer, and generate crosstalk between each other. The ground wall is in physical communication with and electrically coupled to the ground layer. The ground wall extends substantially perpendicular from the ground layer through the dielectric layer. A top surface of the ground wall is a specific height above a top surface of the adjacent different pairs. The ground wall suppresses the generated crosstalk based on the specific height and a width of the ground wall.

A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.

An extensible and contractible wiring board includes first and second extensible and contractible wiring substrates formed by respective wiring at extensible and contractible substrates. Each of the first and second extensible and contractible wiring substrates has a first end having functional units and an intermediate wiring portion, with the wiring and the functional units of the first and second extensible and contractible wiring substrates not electrically connected. Moreover, the first and second extensible and contractible wiring substrates are electrically independent extensible and contractible wiring substrates, and the wirings and the functional units do not overlap at the first ends of the first and second extensible and contractible wiring substrates in top view of the extensible and contractible wiring board, and the intermediate wiring portions of the first and second extensible and contractible wiring substrates overlap in top view of the extensible and contractible wiring board.

A signal transmission circuit includes: a circuit board stored in a housing; a connector which is mounted on the circuit board and includes a first signal terminal and a first ground terminal; and an integrated circuit which is mounted on the circuit board and includes a second signal terminal and a second ground terminal. The first signal terminal and the second signal terminal are connected to each other by a signal wiring arranged on the circuit board. The first around terminal and the second ground terminal are connected to each other by a ground wiring arranged in a predetermined range including a portion immediately above or immediately below the signal wiring in the circuit board. At least a part of the ground wiring immediately above or immediately below the signal wiring has a high impedance structure formed to be wider than the signal wiring and narrower than a combined width of the first signal terminal and the first ground terminal.

A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelope an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelope a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.

A wiring board according to the present disclosure includes a core insulating layer, a first laminated body located on an upper surface of the core insulating layer, and a second laminated body located on a lower surface of the core insulating layer. Each of the first laminated body and the second laminated body has a structure in which at least four electrical conductor layers and at least three build-up insulating layers are alternately located. The electrical conductor layers include two types, that are a first electrical conductor layer and a second electrical conductor layer. In the electrical conductor layers in the first laminated body, at least a first outermost layer and a first innermost layer are the first electrical conductor layers, and a first intermediate layer located farther from the core insulating layer than the first innermost layer includes at least two or more of the second electrical conductor layers.