A display device includes: a display panel; an input sensor disposed on the display panel; a flexible circuit board connected to the display panel and the input sensor; a first differential signal line and a second differential signal line, which are disposed on the flexible circuit board and connected to the display panel; and a transmission line and a receiving line, which are disposed on the flexible circuit board and connected to the input sensor. In a plan view, the receiving line is disposed between the first differential signal line and the second differential signal line.

Described herein are systems and methods for a design method and new interconnect structures with incorporated interdigital trapezoidal tabs structures enabled with materials with either larger permittivity or permeability for improved signal integrity.

A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.

Described herein are systems and methods for a design method and new interconnect structures with incorporated interdigital trapezoidal tabs structures enabled with materials with either larger permittivity or permeability for improved signal integrity.

A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing face. The differential pair unit includes two signal via holes, each signal via hole passes through the plurality of layer structures, and an anti-pad corresponding to each signal via hole is disposed on a ground layer through which the signal via hole passes. A part of metal of a ground layer is spaced between two anti-pads. Each signal corresponds to one anti-pad, and a ground layer is spaced between anti-pads.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

Systems, apparatuses, and methods related to a printed circuit board (PCB) with a plurality of layers are described. An edge connector may be formed on an end of the PCB substrate and may include contact pins on an outer layer of the plurality of layers. The edge connector may also include an intra-pair coupling block disposed on one or more interior layers such that at least a portion of the intra-pair coupling block is colinear with at least one contact pin on the outer layer. The electronic device may also include at least one integrated circuit on the PCB and electrically connected to the contact pins. The intra-pair coupling component may induce coupling of signals carried by the contact pins.

A display device includes: a display panel; an input sensor disposed on the display panel; a flexible circuit board connected to the display panel and the input sensor; a first differential signal line and a second differential signal line, which are disposed on the flexible circuit board and connected to the display panel; and a transmission line and a receiving line, which are disposed on the flexible circuit board and connected to the input sensor. In a plan view, the receiving line is disposed between the first differential signal line and the second differential signal line.

Systems and assemblies are provided for transposition channel routing where the characteristics of an escape route can be modified on a printed circuit board (PCB) in a manner that reduces crosstalk and realizes significant signal quality improvement. The techniques involve “transposition” of a signal line pair on the PCB, reduces effect coupling coefficients for individual aggressor signals, thereby reducing the crosstalk. Transposition channel routing techniques can also be applied to other areas on a PCB (e.g., other than escape routes) where space is constrained and other mitigation techniques are not possible. The PCB can include an array of contact pads, a plurality of signal line pairs that include an escape route. One or more transposition junctions disposed within the escape route can route a signal line pair from a first routing channel in the escape route into a second routing channel in the escape route.

An electrical connector includes a terminal module having a circuit board having first through eighth conductive traces sequentially arranged in a transverse direction and corresponding first through eighth terminals, the third terminal and the sixth terminal being configured for transmitting a pair of differential signals, the fourth terminal and the fifth terminal being configured for transmitting another pair of differential signals, the first through eighth conductive traces being respectively electrically connected to corresponding first through eighth terminals, each of the third conductive trace and the fifth conductive trace including a coupling portion, a size of the coupling portion in the transverse direction is larger than a size of the other part of the corresponding conductive trace in the transverse direction, wherein the coupling portion of the third conductive trace and the coupling portion of the fifth conductive trace overlap in an up and down direction to increase mutual coupling.