Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance H.sub.1 between the pair of strip conductors and the ground conductor layer is twice or more a distance H.sub.2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

Systems, apparatuses, and methods related to a printed circuit board (PCB) with a plurality of layers are described. An edge connector may be formed on an end of the PCB substrate and may include contact pins on an outer layer of the plurality of layers. The edge connector may also include an intra-pair coupling block disposed on one or more interior layers such that at least a portion of the intra-pair coupling block is colinear with at least one contact pin on the outer layer. The electronic device may also include at least one integrated circuit on the PCB and electrically connected to the contact pins. The intra-pair coupling component may induce coupling of signals carried by the contact pins.

The invention relates to an EMC filter for a control device. The filter includes a multilayer circuit carrier comprising electrically conductive layers, in particular copper layers, and electrically insulating circuit board layers. According to the invention, the circuit carrier of the aforementioned type forms at least two filter capacitors, wherein in each case the filter capacitors are formed by electrically conductive layers that are formed in the circuit carrier and lie across from one another and/or extend parallel at a distance from each other.

An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.

An electronic module includes a shunt resistor having one end that is connected to one end of a first ground wiring line and another end that is connected to another end of a second ground wiring line. Signal terminals are disposed to be close to the shunt resistor, the signal terminals including a first current detection terminal electrically connected to the one end of the shunt resistor, and a second current detection terminal disposed to be close to the shunt resistor and electrically connected to the other end of the shunt resistor. The shunt resistor is disposed to be close to a first side of a substrate along which the signal terminals are arranged.

A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins, and ground pins. The main circuit unit is arranged in the center of the body. The power pins supply power signal to the main circuit unit. The input pins and the output pins are arranged on a first and a second side of the body separately for electrically connecting to the main circuit unit. The control pins are arranged on the second side of the body and electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins, and the control pins.

A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.

A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.

A paddle card includes a printed circuit board and a twin-axial cable. The PCB includes a first signal pad on a top surface of the PCB and a second signal pad on a bottom surface of the PCB. The second signal pad is directly below the first signal pad. The twin-axial cable includes a first signal conductor coupled to the first signal pad and a second signal conductor coupled to the second signal pad.

Systems and assemblies are provided for transposition channel routing where the characteristics of an escape route can be modified on a printed circuit board (PCB) in a manner that reduces crosstalk and realizes significant signal quality improvement. The techniques involve “transposition” of a signal line pair on the PCB, reduces effect coupling coefficients for individual aggressor signals, thereby reducing the crosstalk. Transposition channel routing techniques can also be applied to other areas on a PCB (e.g., other than escape routes) where space is constrained and other mitigation techniques are not possible. The PCB can include an array of contact pads, a plurality of signal line pairs that include an escape route. One or more transposition junctions disposed within the escape route can route a signal line pair from a first routing channel in the escape route into a second routing channel in the escape route.