An electronic device and shield can structure are provided. The electronic device includes a housing, a circuit board disposed in the housing and one or more electronic components mounted on the circuit board, a shield can coupled to the circuit board and covering the one or more electronic components, one or more first fastening structures disposed on the circuit board and coupled to the shield can, the one or more first fastening structures having a first width, and one or more second fastening structures extending from the one or more first fastening structures, the one or more second fastening structures having a second width smaller than the first width.

A process condition measurement wafer assembly is disclosed. In embodiments, the process condition measurement wafer assembly includes a bottom substrate and a top substrate. In another embodiment, the process condition measurement wafer assembly includes one or more electronic components disposed on one or more printed circuit elements and interposed between the top substrate and bottom substrate. In another embodiment, the process condition measurement wafer assembly includes one or more shielding layers formed between the bottom substrate and the top substrate. In embodiments, the one or more shielding layers are configured to electromagnetically shield the one or more electronic components and diffuse voltage potentials across the bottom substrate and the top substrate.

An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided. An electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, wherein the electroconductive particles contain flaky electroconductive particles and spherical electroconductive particles, the average particle size of the spherical electroconductive particles is 1 to 10 μm, the content of the flaky electroconductive particles and the spherical electroconductive particles in the electroconductive adhesive layer is 70 to 80% by weight, the weight ratio of the flaky electroconductive particles to the spherical electroconductive particles, [flaky electroconductive particles]/[spherical electroconductive particles], is 6/4 to 8/2, and the thickness of the electroconductive adhesive layer is 5 to 20 μm.

This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

This application relates to the field of chip technologies, and provides a reinforcement structure and an electronic device. The reinforcement structure includes a support frame, an accommodation chamber, and an electromagnetic radiation suppression structure. The accommodation chamber is provided on the support frame and runs through a first surface and a second surface of the support frame that are opposite to each other. The accommodation chamber is used for accommodating a chip package structure disposed on a printed circuit board. A wall surface that is of the support frame and that defines the accommodation chamber is an inner surface, and a wall surface of the support frame opposite to the inner surface is an outer surface. The electromagnetic radiation suppression structure is disposed on at least one of the first surface, the second surface, the inner surface, and the outer surface.

Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.

In a circuit board, a printed board includes an insulating base and a plurality of conductors disposed in layers in the insulating base. The conductors include a signal line electrically connected to an electronic component; and a potential fixed layer fixed to a predetermined potential and arranged to face the signal line across the insulating base in a thickness direction of the printed board. The potential fixed layer has a facing surface facing the signal line, and is provided with a high magnetic film having a magnetic permeability higher than that of the at least one potential fixed layer on the facing surface. The high magnetic film is disposed to overlap the signal line in the thickness direction. The signal line includes a facing line that faces the high magnetic film across the insulating base in the thickness direction.

A process condition measurement wafer assembly is disclosed. In embodiments, the process condition measurement wafer assembly includes a bottom substrate and a top substrate. In another embodiment, the process condition measurement wafer assembly includes one or more electronic components disposed on one or more printed circuit elements and interposed between the top substrate and bottom substrate. In another embodiment, the process condition measurement wafer assembly includes one or more shielding layers formed between the bottom substrate and the top substrate. In embodiments, the one or more shielding layers are configured to electromagnetically shield the one or more electronic components and diffuse voltage potentials across the bottom substrate and the top substrate.

Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.

A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided. A shielded printed wiring board with a ground member of the present invention is a shielded printed wiring board with a ground member, including: a substrate film formed by sequentially stacking a base film, a printed circuit including a ground circuit, and an insulating film; a shielding film including a shielding layer and a protective layer laminated on the shielding layer, the shielding film covering the substrate film such that the shielding layer is closer to the substrate film than the protective layer is; and a ground member arranged on the protective layer of the shielding film, the ground member including an external connection member having a first main surface and a second main surface opposite to the first main surface, and having electroconductivity, electroconductive particles disposed on the first main surface side, and an adhesive resin for fixing the electroconductive particles to the first main surface, wherein circularity of the cross sections of the electroconductive particles in the cross section of the ground member is 0.35 or more, and the electroconductive particles are penetrating the protective layer of the shielding film and connected to the shielding layer of the shielding film, and the external connection member of the ground member is electrically connectable to an external ground.