An electromagnetic band gap element is provided. In the electromagnetic band gap element, a first planar conductor and a second planar conductor are respectively formed on a first plane and a second plane which are parallel to each other, and a first linear conductor is formed on at least one third plane that is parallel to the first plane and the second plane and is located between the first plane and the second plane. The first planar conductor and the second planar conductor are connected via the first linear conductor.

A printed circuit board (PCB) structure is provided for a solid state drive. In an embodiment, a solid state drive includes top and bottom layers, multiple intermediate layers and a ground cage. Each of top and bottom layers includes a plurality of components for operation of the solid state drive. The multiple intermediate layers enable electrical signals to pass between components on the top and bottom layers, one of the multiple intermediate layers including a power plane having a high voltage relative to each of the other planes. The ground cage shields signal traces on the same layer as the power plane and planes in adjacent layers from noise generated by the power plane.

An electronic circuit includes plural individual electronic circuits arranged, in which each of the plural individual electronic circuits has a first conductor column that is connected to a ground of a first layer which is any one of plural conductor layers sequentially stacked in a separated state and extends in a stacking direction, a conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer which is any one of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor column that is connected to the conductor line, is not connected to the ground, and extends in the stacking direction, and each of a first individual electronic circuit and a second individual electronic circuit adjacent to each other among the plural individual electronic circuits has at least a pair of the second conductor columns, which are formed at adjacent positions without interposing any one of the conductor lines of the first individual electronic circuit and the second individual electronic circuit between the pair of the second conductor columns.

An electronic circuit includes a conductor column that is connected to a ground of a first layer which is any one of plural conductor layers stacked in a separated state and extends in a stacking direction, a first conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor line that extends in a band shape in any layer of the plural conductor layers, in which each of the first conductor line and the second conductor line has one neighboring portion constituting at least a pair of neighboring portions, which are close to each other to be connectable, and a first end portion of the second conductor line, which is separated from the neighboring portion formed on the second conductor line, is an open end.

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

A communication device includes a ground plane, an antenna array, and an EBG (Electromagnetic Band Gap) structure. The antenna array includes a plurality of antenna elements. The EBG structure includes a plurality of EBG units. The EBG units are coupled to the ground plane. The antenna array is surrounded by the EBG structure. The EBG structure is configured to suppress the front-to-back ratio of the radiation efficiency of the antenna array.

An electromagnetic band gap structure apparatus includes a first conducting layer having at least one first slot. Each of the at least one slot is arranged with a planar conductor unit, and the each planar conductor unit is coupled to a first via. The electromagnetic band gap structure apparatus further includes a second conducting layer in parallel with the first conducting layer. The second conducting layer has a second slot. The second slot is arranged with at least one planar transmission line unit. The each of the at least one planar transmission line unit is coupled to the first conducting layer through a second via, and the each first via is coupled to the second conducting layer.

A multi-socket panel device with an anti-crosstalk structure, wherein a plurality of through holes are formed on the circuit board. The through holes are arranged in two rows extending from one side of the circuit board to another side of the circuit board. Two electrical connectors disposed on the circuit board are arranged near two opposite sides of the rows of the through holes. The electromagnetic wave propagating in the circuit board are reflected or refracted by the through holes due to travel in different media, whereby the crosstalk caused by the electromagnetic wave is avoided when signals of high frequency are transmitted in two electrical connectors.

The present disclosure relates to a metasurface arrangement including a first metasurface and a second metasurface which run mutually parallel and face each other. Each metasurface includes a corresponding periodic or quasi-periodic structure formed in a respective pattern. The first metasurface is formed in a dielectric material structure and the second metasurface is formed in either a dielectric material structure or in an electrically conducting structure. The periodic or quasi-periodic structure on the first metasurface is configured to yield a first response to an incident electromagnetic wave between the two metasurfaces, and the periodic or quasi-periodic structure on the second metasurface is configured to yield a second response to the incident electromagnetic wave between the two metasurfaces that is equivalent to the first response, thereby rendering the two metasurfaces mutually electromagnetically symmetric.

A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.