An antenna device comprises: a printed circuit board formed with both sides in a plate shape including a first surface and a second surface and including at least one conductive layer between the first surface and the second surface; an array of conductive plates formed parallel to the first surface on or in the printed circuit board; a wireless communication circuit electrically connected to the array of conductive plates, coupled to the first surface, and capable of transmitting or receiving frequencies between 3 GHz and 300 GHz; and a conductive shielding structure mounted on the first surface of the printed circuit board and electrically connected to the at least one conductive layer when covering the wireless communication circuit, wherein the conductive shielding structure may include: a third surface facing the first surface when seen from the top of the first surface; and an electromagnetic bandgap (EBG) structure formed on the third surface.

Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.

An integrated circuit can include a first capacitor in a first end portion of the integrated circuit and including a first plate and a second plate, the first plate of the first capacitor being electrically coupled to ground and within a first metal layer of the integrated circuit, a first transmission line electrically coupled to the second plate of the first capacitor, the first transmission line being within a second metal layer of the integrated circuit, a second capacitor in a second end portion of the integrated circuit and including a first plate and a second plate, the first plate of the second capacitor being electrically coupled to ground and within the first metal layer of the integrated circuit, and a second transmission line electrically coupled to the second plate of the second capacitor, the second transmission line being in the second metal layer of the integrated circuit.

A 3D electromagnetic bandgap circuit includes: a dielectric layer having a first surface and an opposing second surface; a spiral element positioned on the first surface; a first surrounding element positioned on the first surface and surrounding the spiral element, but does not touch with the spiral element; a plane element positioned on the second surface and including a notch; a second surrounding element positioned on the second surface and surrounding the plane element, but does not touch with the plane element, wherein the second surrounding element further includes a protruding portion extending toward the notch; a first via passing through the dielectric layer, the spiral element, and the protruding portion; a second via passing through the dielectric layer, the plane element, and the first surrounding element; and a third via passing through the dielectric layer, the plane element, and the first surrounding element.

An electronic device according to various embodiments may comprise: a housing; an antenna structure positioned in the housing; and a wireless communication circuit. The antenna structure may comprise: a first conductive layer comprising a first opening; a second conductive layer positioned in parallel with the first conductive layer, the second conductive layer comprising a second opening which at least partially overlaps with the first opening when the first conductive layer is seen from above; a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer; a first insulating layer interposed between the first conductive layer and the third conductive layer; a second insulating layer interposed between the second conductive layer and the third conductive layer; a first conductive plate in the first opening, which is electrically separated from the first conductive layer; a second conductive plate in the second opening, which is electrically separated from the second conductive layer; a first conductive via electrically connected between the first conductive plate and the third conductive layer through the first insulating layer; and a second conductive via electrically connected between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 giga hertz (GHz) and 100 GHz and may be electrically connected to the antenna structure. Various embodiments may be possible.

Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and including at least one electromagnetic band gap (EBG) structure, and at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted, wherein each antenna is on a printed circuit board and includes another EBG structure located on an upper layer and a lower layer of the printed circuit board and at least one matching element, at least a part of each of the antennas is located inside the waveguide to form a wireless channel configured to transmit electromagnetic signals in an area between the antennas, and the at least one matching element is located within a specified distance of the wireless channel and is configured to match the antenna with the wireless channel.

The present invention solves the problem that propagation of electromagnetic noise in a predetermined frequency band cannot be suppressed when an existing EBG structure is applied in a multilayer substrate. The structure of the present invention is provided with: a first power plane; a first GND plane faces the first power plane; a second GND plane faces the first power plane or the first GND plane; a first planar conductor facing the first GND plane and/or the second GND plane; a first conductor via for connecting the first planar conductor and the first power plane, the first conductor via being insulated from the first GND plane and the second GND plane; and a second conductor via for connecting the first GND plane and the second GND plane, the second conductor via being insulated from the first power plane and the first planar conductor.

A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.

The present application electromagnetic signal filtering. More specifically, the application teaches a system and method for affixing a frequency selective surface to an existing antenna radome, such that unwanted signals are attenuated before reaching an antenna structure within the antenna radome.