A printed wiring board of the present disclosure includes a power supply layer and a ground layer. A power supply layer pattern to be formed partially on the power supply layer includes a branch and a power supply layer electrode. The branch is a direct-current power feeding path for connecting adjacent electromagnetic band gap (EBG) unit cells, and the power supply layer electrode is connected through a slit provided along the branch. A capacitive coupling element disposed to oppose the power supply layer electrode with an interlayer being provided therebetween has a structure in which the EBG unit cells are disposed at regular intervals, the EBG unit cells being connected to the branch in the power supply layer pattern through a via.

A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.

A multifunctional electromagnetic structure is presently disclosed. Said structure is a true electromagnetic bandgap (EBG) material, with both surface and leaky waves suppressed from the whole structure along all lateral directions. It is also an antenna element, configured to radiate to the broadside direction. The structure has two metallization layers of concentric rings between a square-shaped radiating top metal layer and a bottom ground plane. The lower concentric ring is connected to the ground plane through a plurality of vias, while the patch of the top metal layer is fed with a probe. The EBG unit cells may be used as antenna elements in a phased array environment, where they eliminate scan blindness from the array structure along all scan directions.

A system includes: a printed circuit board having a plurality of conductive traces; a processing device coupled to the printed circuit board and in electrical communication with the plurality of conductive traces; a first memory module and a second memory module in electrical communication with the plurality of conductive traces and sharing channels of the conductive traces, wherein the first memory module is physically more proximate to the processing device than is the second memory module; and an electronic band gap (EBG) structure physically disposed in an area between the first memory module and the second memory module.

An assembly that includes a printed circuit board having an air gap, and a method of fabricating the assembly is disclosed. The assembly includes at least one air gap. This air gap is created by using a soluble material during the PCB assembly process. The soluble material can preferably be processed in accordance with traditional PCB fabrication processes. For example, other materials can be bonded to the soluble material. Additionally, the soluble material is capable of withstanding a drilling process. After the PCB assembly is complete, the soluble material is then dissolved, leaving an air gap where the soluble material once existed. This assembly may be useful in configurations where an antenna, EBG material or other electronic structure is to be disposed above the top surface of the printed circuit board.

An integrated circuit can include a first capacitor in a first end portion of the integrated circuit and including a first plate and a second plate, the first plate of the first capacitor being electrically coupled to ground and within a first metal layer of the integrated circuit, a first transmission line electrically coupled to the second plate of the first capacitor, the first transmission line being within a second metal layer of the integrated circuit, a second capacitor in a second end portion of the integrated circuit and including a first plate and a second plate, the first plate of the second capacitor being electrically coupled to ground and within the first metal layer of the integrated circuit, and a second transmission line electrically coupled to the second plate of the second capacitor, the second transmission line being in the second metal layer of the integrated circuit.

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

An assembly for electromagnetic interference (EMI) shielding to prevent incident radiation from penetrating through a gap to an interior of an aircraft includes an electromagnetic band gap (EBG) structure. The EBG structure has a patch-and-via array connected to a ground layer. The EMI shielding includes a conductive adhesive and is flexible for conforming attachment to curved aircraft surfaces. The shielding may be located on a deflector plate that is parallel to an adjacent aircraft surface, on the airframe surface opposite to the deflector plate, or in both locations. The assembly filters out penetrating electromagnetic energy and prevents highly resonant cavity mode build-ups of electromagnetic energy inside a nacelle or other enclosure effectively protecting electrical equipment in the interior.

A Launcher in Package (LiP) device for wireless communications, e.g., radar communications at 77 GHz, includes a printed circuit board (PCB) arranged between a radio frequency (RF) chip package and a radiating antenna structure. The PCB include an electromagnetic bandgap (EBG) structure including a plurality of EBG elements printed in a periodic pattern on the side of the PCB facing the radiating antenna structure. The plurality of EBG elements border at least one side of an RF channel through the PCB that couples an antenna element of the radiating antenna structure with a corresponding RF launcher in the RF chip package.

A method and apparatus for producing a radio frequency absorbing (RFA) or perfect microwave absorbing (PMA) printed circuit board (PCB) is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA PCB, which may comprise a multi-layered assembly for absorption of electromagnetic radiation in a targeted frequency range such as the microwave frequency range in the PCB.