Various examples related to microwave dielectric analyzers and their use are provided. In one example, a microwave dielectric analyzer includes a measurement apparatus having a conductive electrode that can couple to a microwave analyzer and processing circuitry that can determine a dielectric characteristic of the dielectric specimen using a reflection coefficient measured by the microwave analyzer. The dielectric characteristic can be determined using a computational electromagnetic model of the measurement apparatus. The reflection coefficient can be measured by the microwave analyzer with the dielectric specimen in contact with the conductive electrode and/or sandwiched between conductive electrodes. The conductive electrodes can be axially aligned, and the second electrode may not be coupled to the microwave analyzer.

Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.

A film for an electronic board, according to one embodiment, has a low dielectric constant of 2.9 or lower at a frequency of 10-40 GHz, and thus can cause the signal transmission rate for a high frequency use, such as fifth generation (5G) mobile communication, to be superior to that of a conventional film for an electronic board. In addition, the film for an electronic board has flexibility and physicochemical characteristics that are greater than or equal to those of a conventional film, so as to be applicable to the manufacture of a laminate of a conductive film such as FCCL and an electronic board such as a FPCB, thereby enabling processability, durability, transmission capacity and the like to be improved.

First and second conductors extend on and along a first surface of a substrate. The first conductor includes first and second parts extending in first and second directions and a third part connected to the first and second parts. The second conductor includes fourth and fifth parts extending in the first and second directions and a sixth part connected to the fourth and fifth parts. A first insulator partly covers the first surface, covers the first to fifth parts, and is partly opened in a first region extending along the sixth part above the sixth part in a third direction.

A phase shifter includes a printed circuit board and a trace located on the printed circuit board that is configured to transmit signals. The printed circuit board includes a first part covered by the trace and a second part not covered by the trace, where the second part includes at least one hollowed out area near the trace.

A printed circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and surrounding the second circuit pattern; and a protective layer disposed on an upper surface of the second insulating layer, wherein the second insulating layer has at least one recess formed on its upper surface, and wherein the protective layer is disposed in the recess formed on the upper surface of the second insulating layer.

Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a Kurtosis (Rku) of the first surface ranges from 3.0 to 60.0. With the Rku, the LCP film is able to improve the peel strength with a metal foil and ensure that a laminate comprising the same maintains the merit of low insertion loss.

A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.

An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.

Provided is copper foil with a resin layer, the resin layer having excellent adhesion, the copper foil exhibiting low dielectric characteristics, which is suitable for high-frequency applications, the copper foil being capable of exhibiting excellent characteristics of reducing transmission loss. More specifically, a laminate of copper foil and an epoxy resin composition layer is provided, the epoxy resin composition layer being present on at least one surface of the foil, the epoxy resin composition containing an epoxy resin and an acid-modified polyolefin, wherein a test piece composed of the laminate and a prepreg has 90-degree peel strength between the copper foil and the prepreg of 0.6 N/mm or more as measured in accordance with JISC6481, and has a reduction rate of the 90-degree peel strength between the copper foil and the prepreg of 20% or less after immersion of the test piece in boiling water for 2 hours.