A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a microwave structure embedded at least partially in the stack. The microwave structure configured for exciting a microwave propagation mode and having at least two stack pieces being interconnected with each other at an electrically conductive connection interface.

A radio frequency (RF) jamming device includes a differential segmented aperture (DSA), a jammer source outputting a jamming signal at one or more frequencies or frequency bands to be jammed, and RF electronics that amplify and feed the jamming signal to the DSA so as to emit a jamming beam. The DSA includes an array of electrically conductive tapered projections, and the RF electronics comprise power splitters configured to split the jamming signal to aperture pixels of the DSA. The aperture pixels comprise pairs of electrically conductive tapered projections of the array of electrically conductive tapered projections. The RF electronics further comprise pixel power amplifiers, each connected to amplify the jamming signal fed to a single corresponding aperture pixel of the DSA. The RF jamming device may include a rifle-shaped housing, with the DSA mounted at a distal end of the barrel of the rifle-shaped housing.

A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.

A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.

An interconnect structure includes a first conductor, a second conductor, a dielectric block, a substrate, and a pair of conductive lines. The first conductor and the second conductor form a differential pair design. The dielectric block surrounds the first conductor and the second conductor. The first conductor is separated from the second conductor by the dielectric block. The substrate surrounds the dielectric block and is spaced apart from the first conductor and the second conductor. The pair of conductive lines is connected to the first conductor and the second conductor, respectively, and extends along a top surface of the dielectric block and a top surface of the substrate.

The present invention relates to a multi-mode filter comprising a carrier on which is mounted a dielectric resonator having a covering of an electrically conductive material in which there is provided an aperture and a coupling structure for coupling input signals to the dielectric resonator or for extracting filtered output signals from the dielectric resonator. The carrier is provided with an enclosing formation of electrically conductive material, which enclosing formation is electrically coupled to the electrically conductive covering of the dielectric resonator, such that the covering and the enclosing formation together form an electrically conductive enclosure for the dielectric resonator. The enclosure formed from the covering of the dielectric resonator and the enclosing formation increases the isolation of the filter and reduces leakage. The filter of the present invention is particularly suitable for use in cascaded resonator filter arrangements, and in duplex/diplex filters.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be

##STR00001##

or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen

##STR00002##

or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is

##STR00003##

wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is

##STR00004##

wherein e is 0-10.

A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.

A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.