A semiconductor package includes a metal baseplate having a die attach region and a peripheral region, a transistor die having a reference terminal attached to the die attach region and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the peripheral region and a second side facing away from the baseplate. The multilayer circuit board includes two embedded electrically conductive layers that are separated from the first and second sides by layers of composite fiber, and an embedded dielectric layer disposed between the two embedded electrically conductive layers. The embedded dielectric layer has a higher dielectric constant than the layers of composite fiber.

A flexible flat cable structure capable of improving crosstalk interference includes plural telecommunication signal conductors separated from one another and provided for transmitting differential signals, two support members installed on two lateral sides of the telecommunication signal conductor respectively, at least one filled material disposed between the telecommunication signal conductors. The ratio of the equivalent dielectric constant of the filled material to the equivalent dielectric constant of the support members falls within a range of 0.39˜0.27, and the ratio of the thickness of the filled material to the thickness of the support members falls within a range of 1.49˜1.37. Therefore, the flexible flat cable structure achieves the effects of reducing the time delay of the signal transmission of the flexible flat cable (FFC), suppressing the ringing noise of resonance, and improving the eye height of amplitude measurement, so as to suppress crosstalk interference and improve signal transmission quality effectively.

An electronic device includes a signal sender that sends a pair of transmission signals of mutually opposite phases to an external device via a pair of transmission paths. The signal sender differentiates each amplitude of the pair of transmission signals.

A high-frequency signal transmission line includes a body including a plurality of first base layers and a second base layer stacked on one another in a stacking direction. The first base layers have a first relative permeability, and the second base layer has a relative permeability lower than the first relative permeability. A first signal line and a second signal line extending along the first signal line are provided in the body. In a cross section perpendicular or substantially perpendicular to a first direction in which the first signal line extends, the second base layer occupies at least a portion of an area between the first signal line and the second signal line. In the cross section perpendicular or substantially perpendicular to the first direction, the plurality of first base layers define a loop enclosing the first signal line, the second signal line and the second base layer.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

A wiring circuit board includes an insulating base layer, a conductive layer disposed on a one-side surface in a thickness direction of the insulating base layer, a cover insulating layer disposed on the one-side surface in the thickness direction of the insulating base layer to cover the conductive layer, and a shield layer disposed on the other-side surface in the thickness direction of the insulating base layer and both side surfaces in the width direction of the insulating base layer and on a one-side surface in the thickness direction of the cover insulating layer and both side surfaces in the width direction of the cover insulating layer. At least one of the insulating base layer and the cover insulating layer has a porous resin layer.

One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.

A radio frequency (RF) jamming device includes a differential segmented aperture (DSA), a jammer source outputting a jamming signal at one or more frequencies or frequency bands to be jammed, and RF electronics that amplify and feed the jamming signal to the DSA so as to emit a jamming beam. The DSA includes an array of electrically conductive tapered projections, and the RF electronics comprise power splitters configured to split the jamming signal to aperture pixels of the DSA. The aperture pixels comprise pairs of electrically conductive tapered projections of the array of electrically conductive tapered projections. The RF electronics further comprise pixel power amplifiers, each connected to amplify the jamming signal fed to a single corresponding aperture pixel of the DSA. The RF jamming device may include a rifle-shaped housing, with the DSA mounted at a distal end of the barrel of the rifle-shaped housing.

The instant invention provides a curable composition suitable for electrical laminate applications, and electrical laminates made therefrom. The curable composition suitable for electrical laminate applications according to the present invention comprises a) an epoxy resin; and b) a hardener compound for curing with the epoxy resin; and c) titanium dioxide.