A communication device includes a communication connector, a communication control circuit, and a common mode filter. The communication control circuit controls communication that is established by way of the communication connector. The common mode filter is connected to each of the communication control circuit and the communication connector to relay the communication. Letting a wavelength corresponding to a clock frequency of an electric signal sent out from the communication control circuit be denoted as λ, an electrical length of a signal path at which resonance is produced by a reflected wave resulting from reflection of the electric signal by the common mode filter is closer to an even multiple of λ/2 than to an odd multiple thereof.

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.

A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.

A flexible circuit board for transmitting a signal in a frequency band includes an intermediate region in which a signal line is disposed as a transmission line for transmitting the signal in the frequency band, and a pad region extending from the intermediate region and disposed at one end or both ends of the flexible circuit board, a pad electrically connected to the signal line and formed to face a first direction of the flexible circuit board, and a ground pattern overlapping at least a portion of the pad and formed to face a second direction of the flexible circuit board and disposed in the pad region where the second direction is opposite to the first direction.

In examples, a semiconductor package comprises a ceramic substrate and a horizontal metal layer covered by the ceramic substrate. The metal layer is configured to carry signals in the 5 GHz to 38 GHz frequency range. The package also includes a vertical castellation on an outer surface of the ceramic substrate, the castellation coupled to the metal layer and having a height ranging from 0.10 mm to 0.65 mm.

A printed circuit board (PCB) includes first and second signal voids and a guard trace formed on a surface of the PCB. The first and second signal voids are for connecting to signal contacts of a high-speed data communication interface. The guard trace is located between the first signal void and the second signal void. The PCB further includes first, second, and third ground vias that couple the guard trace to a ground plane of the PCB. The first ground via is located at a first end of the guard trace. The second ground via is located at a second end of the guard trace. The third ground via is located between the first via and the second via.

According to one embodiment of the present disclosure, an antenna device, an apparatus for manufacturing the same, and a method for manufacturing the same are disclosed. The antenna device according to one embodiment of the present disclosure comprises an antenna substrate sheet and an antenna pattern. A connecting PCB is attached on the antenna substrate sheet. The antenna pattern starts from one of a plurality of connecting terminals of the connecting PCB and ends at another one of the plurality of connecting terminals. The antenna pattern comprises a plurality of wires which functions as one line and a bridge. The plurality of wires is embedded on the antenna substrate sheet. The bridge connects the connecting PCB and a point where winding of the plurality of wires on the antenna substrate sheet is completed.

Semiconductor packages with pass-through clock traces and associated devices, systems, and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate including a first surface having a plurality of substrate contacts, a first semiconductor die having a lower surface attached to the first surface of the package substrate, and a second semiconductor die stacked on top of the first semiconductor die. The first semiconductor die includes an upper surface including a first conductive contact, and the second semiconductor die includes a second conductive contact. A first electrical connector electrically couples a first one of the plurality of substrate contacts to the first and second conductive contacts, and a second electrical connector electrically couples a second one of the plurality of substrate contacts to the first and second conductive contacts.

A multiple-antenna device including a printed circuit board, a first antenna formed into a first corner of the printed circuit board, a second antenna formed into a second corner of the printed circuit board, and a dual-band decoupler formed in the printed circuit board between the first antenna and the second antenna. The multiple-antenna device includes WLAN circuitry located on the printed circuit board between the first antenna and the decoupler. The first and second antennas have polarizations orthogonal to each other.

A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.