A printed circuit board (PCB) is provided for transmitting a differential signal. The PCB includes first and second conductive signal layers. The first conductive signal layer includes a first positive trace of the differential signal and a first negative trace of the differential signal. The second conductive signal layer includes a second positive trace of the differential signal and a second negative trace of the differential signal. The first positive trace is adjacent to the first negative trace, and the second positive trace is adjacent to the second negative trace and directly below the first negative trace.

A paddle card includes a printed circuit board and a twin-axial cable. The PCB includes a first signal pad on a top surface of the PCB and a second signal pad on a bottom surface of the PCB. The second signal pad is directly below the first signal pad. The twin-axial cable includes a first signal conductor coupled to the first signal pad and a second signal conductor coupled to the second signal pad.

A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.

First and second conductors extend on and along a first surface of a substrate. The first conductor includes first and second parts extending in first and second directions and a third part connected to the first and second parts. The second conductor includes fourth and fifth parts extending in the first and second directions and a sixth part connected to the fourth and fifth parts. A first insulator partly covers the first surface, covers the first to fifth parts, and is partly opened in a first region extending along the sixth part above the sixth part in a third direction.

An integrated circuit device includes an integrated circuit device die and a substrate. The integrated circuit device die includes a plurality of first contact pads. The first contact pads include a pair of first signal contact pads configured to provide a differential signal port of the integrated circuit device die. The differential signal port is configured to operate at a predetermined frequency. The substrate includes a plurality of second contact pads on a first surface of the substrate. The second contact pads are configured to be soldered to a printed circuit board, and include a pair of second signal contact pads. The integrated circuit device die is affixed to a second surface of the substrate via the first contact pads. The substrate includes a pair of circuit paths that each couple one of the first signal contact pads to an associated one of the second signal contact pads. The pair of circuit paths each have a length to provide a half-wave matching network at the predetermined frequency to match a single-ended signal at the pair of second signal pads to the differential signal port.

A transmission circuit includes a first semiconductor device, a second semiconductor device, a first signal line, a second signal line, a third signal line, and a ground line. A differential signal is composed of a first signal and a second signal. The first signal line is configured to connect the first semiconductor device and the second semiconductor device and used to transmit the first signal. The second signal line is configured to connect the first semiconductor device and the second semiconductor device and used to transmit the second signal. The second signal line, the first signal line, the ground line, and the third signal line are disposed in this order. A distance between the first signal line and the ground line is larger than a distance between the first signal line and the second signal line.

A printed wiring board includes an insulating layer, and a conductor layer including a solid layer and wirings. The solid layer has an opening part. The wirings are formed in the opening part. The opening part includes first and second opening parts. The wirings include first and second wirings. The first wiring has a first land, a first portion, and a second portion. The second wiring has a second land, a third portion, and a fourth portion extending in parallel to the second portion. A first boundary between the first and second portions is in the second opening part. The first portion is bending at the first boundary and increasing distance between the first and second wirings. A second boundary between the third and fourth portions is in the second opening part. The third portion is bending at the second boundary and increasing distance between the first and second wirings.

An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.