Patent classifications
H05K1/0245
Cable connector for high speed in interconnects
A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.
Method for examining differential pair transmission lines
A method for examining differential pair transmission lines, performed by a processor, comprising: capturing a plurality of first insertion losses of a first signal line within a frequency range and a plurality of second insertion losses of a second signal line within the frequency range, wherein the first signal line and the second signal line are configured to transmit a pair of differential signals; calculating a plurality of maximum error ratios between the first insertion losses and the second insertion losses within the frequency range; determining whether any one of the maximum error ratios is greater than or equal to an upper threshold; outputting a warning signal when the processor determines one of the maximum error ratios is greater than or equal to the upper threshold; and ending the method when the processor determines each one of the maximum error ratios is smaller than the upper threshold.
Systems and methods for varying an impedance of a cable
A system may include a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings. The system may also include a plurality of electrically-conductive pads formed on a surface of the surface layer and a cable comprising a first signal conductor mechanically contacted to a first pad of the plurality of electrically-conductive pads and a first drain conductor mechanically contacted to the ground plane through the one or more openings.
Connecting Electrical Circuitry in a Quantum Computing System
In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.
Antenna-to-Printed Circuit Board Transition
This document describes techniques, apparatuses, and systems for an antenna-to-printed circuit board (PCB) transition. An apparatus (e.g., a radar system) may include an MMIC or other processor to generate electromagnetic signals. The apparatus can include a PCB that includes multiple layers, a first surface, and a second surface that is opposite and in parallel with the first surface. The PCB can also include a dielectric-filled portion formed between the first surface and second surface. The apparatus can also include a conductive loop located on the first surface and connected to a pair of lines. The apparatus can further include a transition channel mounted on the first surface and positioned over the dielectric-filled portion. The described transition can reduce manufacturing costs and board sizes, reduce energy losses, and support a wide bandwidth.
BALUN PHASE AND AMPLITUDE IMBALANCE CORRECTION
In one example, an apparatus comprises: a first metal layer including a first segment and a second segment, in which the first segment is electrically coupled to a single-ended signal terminal, the second segment has a disconnected end; a second metal layer including a third segment and a fourth segment, in which the third segment is magnetically coupled to the first segment, the fourth segment is magnetically coupled to the second segment, a first end of the third segment and a first end of the fourth segment are electrically coupled at a center tap, and a second end of the third segment and a second end of the fourth segment are electrically coupled to respective first and second signal terminals of a pair of differential signal terminals; and a phase adjustment device proximate the center tap and electrically coupled to a second voltage reference terminal.
SYSTEMS AND METHODS FOR BREAK OUT OF INTERCONNECTIONS FOR HIGH-DENSITY INTEGRATED CIRCUIT PACKAGES ON A MULTI-LAYER PRINTED CIRCUIT BOARD
A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.
CIRCUIT BOARD AND SEMICONDUCTOR MODULE
A circuit board includes a first insulating layer; a first wiring pattern and a second wiring pattern each formed to be side to side with each other on an upper surface of the first insulating layer; a second insulating layer formed on the upper surface of the first insulating layer to cover the first and second wiring patterns; a third wiring pattern formed on an upper surface of the second insulating layer to overlap the first wiring pattern in a vertical direction; a fourth wiring pattern formed on the upper surface of the second insulating layer to overlap the second wiring pattern in the vertical direction; a first via passing through the second insulating layer and connecting the first and fourth wiring patterns; and a second via passing through the second insulating layer and connecting the second and third wiring patterns.
Bend compensation for conductive traces on printed circuit boards
A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.
CIRCUIT BOARD HAVING COMPLEMENTARY SIGNAL CONDUCTING PATTERNS
A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.