A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.

Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

A galvanic isolator includes a multi-layer printed circuit board (PCB) including a dielectric material having a top side and a bottom side. An RF transmission line is embedded within the PCB including a plurality of conductor traces spaced apart from one another to include a plurality of gaps (G1 and G2) in a path of the RF transmission line to provide an inline distributed capacitor that together with an impedance of the RF transmission line forms a bandpass (BP) filter. A top metal layer is on the top side and a bottom metal layer on the bottom side connected to one another by a plurality of metal filled vias on respective sides of the RF transmission line. The top metal layer and bottom metal layer each also include at least one gap.

The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the distances of the gold fingers are different. The disclosure is further related to a liquid crystal display. By the above manner, the disclosure is able to change the distances between the adjacent gold fingers to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board, and in the meanwhile to increase the assembling yield rate of the flexible printed circuit board.

Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.

The present disclosure relates to a PCB and a method in the PCB for reducing common-mode current. The PCB comprises two differential lines and each of the differential lines is on one or more planes of the PCB. The two differential lines carry a differential mode current and the common mode current. The differential mode current and the common mode current may be at least one of a forward current and a backward current. Further, a predefined configuration is formed using each of the two differential lines to generate impedance at the predefined configuration. Here, the predefined configuration is placed close to each other to generate a dielectric capacitance. The flow of the forward current and the backward current in adjacent tracks of each of the two differential lines in the predefined configuration are in opposite direction.

A signal transmission device includes a signal side electrode; a first signal line connected to one side of the signal side electrode; a second signal line connected to the other side of the signal side electrode; a power source side electrode that forms a pair with the signal side electrode and is connected to the signal side electrode via an electronic component including at least an inductor component; and a capacitive coupling part that capacitively couples the power source side electrode to a ground wiring or a power source wiring. The first signal line, the signal side electrode, and the second signal line form a transmission path for transmitting an electric signal. The first signal line and the second signal line transmit power via the signal side electrode, the electronic component, and the power source side electrode.

A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

A repeater includes two connectors each including electrodes and configured to connect a communication cable through which a differential signal is transmitted, a circuit board on which the two connectors are mounted and which includes a signal transmission section configured to connect corresponding electrodes of the two connectors together, and a signal detection circuit mounted on the circuit board and configured to extract a part of a signal transmitted through the signal transmission section and indicate the presence or absence of information communication based on the extracted signal. The circuit board includes a multi-layer substrate including at least an inner layer in which the signal transmission section is formed, two shield layers configured to interpose the signal transmission section therebetween, and an outer layer outside the shield layer on which the signal detection circuit is mounted.