An electronic control device including a circuit substrate having a signal wiring and a ground wiring; at least one connector having a signal conductor and a ground conductor respectively connected to the signal wiring and the ground wiring of the circuit substrate on one end side and extending on the other end side; a housing including an accommodating portion that accommodates the circuit substrate and the at least one connector, in which a radio wave path through which a leakage electromagnetic wave propagates from one end on the circuit substrate side toward the other end on the side opposite to the circuit substrate side of the at least one connector is formed in an internal space at the periphery of the at least one connector; and a leakage electromagnetic wave attenuating structure provided between the housing and the at least one connector; where the leakage electromagnetic wave attenuating structure includes a plurality of conductors that are arrayed along a direction in which the leakage electromagnetic wave propagates from the one end of the at least one connector, and attenuate the leakage electromagnetic wave propagating through the radio wave path.

Connector paddle cards are provided with an improved wiring connection geometry that reduces impedance mismatch. One illustrative embodiment is a printed circuit board having, on at least one surface: edge connector traces arranged along a first edge for contacting electrical conductors in a socket connector; an outer set of electrodes arranged parallel to a second edge for attaching exposed ends of sheathed wires in a cable (“outer wires”); and an inner set of electrodes arranged parallel to the second edge for attaching exposed ends of sheathed wires in a cable (“inner wires”), with the electrodes in the inner set being staggered relative to the electrodes in the outer set.

Impedance assembly (120) for use in a voltage divider for sensing an AC elevated voltage of at least 1 kV of a power-carrying conductor (10) distributing electrical energy in a national grid. The impedance assembly comprises a) a PCB (170); b) a high-voltage contact (80) for connection to the power-carrying conductor; c) a first plurality of impedance elements (70) on the PCB, connected to the high-voltage contact and in series with each other such as to be operable in a first voltage divider (20) for sensing the voltage of the power-carrying conductor; and d) a second plurality of impedance elements (71) on the PCB, connected to the high-voltage contact and in series with each other such as to be operable in a second voltage divider (21) for harvesting electrical energy from the power-carrying conductor.

One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.

A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

Disclosed is an antenna impedance matching circuit, an antenna system, a printed circuit board, and a terminal. The antenna impedance matching circuit comprises: a first transmission line having a first specific length such that the first transmission line is capacitive, and a second transmission line having a second specific length such that the second transmission line is inductive. In particular, the first transmission line and the second transmission line are connected in parallel, and terminals of the first transmission line and the second transmission line are open or shorted.

A surface wave excitation device includes a transmission line disposed on a wire layer PCB, and a same quantity of layers are respectively disposed above and below the wire layer PCB. A copper wire is disposed on each layer of PCB, and the copper wire forms a closed region. Closed regions on the PCB that are respectively disposed above and below the wire layer PCB and that have a same distance from the wire layer PCB are in a same shape, and a closed region on a PCB farther away from the wire layer PCB occupies a larger area. The wire layer PCB includes first and second closed regions, the first closed region is disposed on one side of the transmission line, and the second closed region is disposed on the other side, and shapes of the first and second closed regions are mutually symmetrical with the transmission line as a symmetry axis.

The movable coil for a flat plate speaker according to an embodiment of the present invention includes a PCB coil and a metal coil. The PCB coil plate forms a single layer or multiple layers. In the PCB coil, a coil track is spirally pattern-printed on a single layer PCB coil plate. Otherwise, each of a plurality of coil tracks is spirally pattern-printed on each of multilayer PCB coil plates, and, the plurality of coil tracks are electrically connected to each other. The metal coil is electrically connected to the PCB coil and wound in a planar spiral shape. The coil track includes straight section effective tracks patterned on the upper and lower portions of one surface of the PCB coil plate, respectively, and idle tracks patterned on left and right portions of the one surface of the PCB coil plate, respectively. The straight section effective tracks are formed by connecting multiple lines in parallel, the idle tracks are formed by singular lines, and the coil track is formed in a spiral shape as multiple lines and singular lines are alternately repeated.

A radio frequency circuit with font routing to replace a resistor includes a routing layer and a ground layer. The routing layer includes a first pad, a second pad and a font routing unit. The second pad is corresponding to the first pad. The font routing unit is connected between the first pad and the second pad, and has a trace width. The trace width is less than a 50 ohm trace width. The ground layer is disposed below the routing layer and is separated from the routing layer by a height. The font routing unit has a second equivalent impedance at the radio frequency, the second equivalent impedance is determined according to the trace width, the height and the radio frequency, and the second equivalent impedance is the same or similar to a first equivalent impedance.

A high-speed transmission circuit comprises a connector pin that serves as part of a signal path, has a first conductivity, and has a connector pin leg that is coupled to a pad that has a second conductivity lower than the first conductivity. The connector pin leg and at least a portion of the pad form a resonant sub-circuit coupled to the signal path. The second conductivity causes a reduction in insertion loss in the signal path by damping a current in the resonant sub-circuit.