A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.

An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

A flexible circuit board, a method for manufacturing the flexible circuit board, and a display device are provided. The flexible circuit board includes: a plurality of driving signal lines arranged with mutually insulate-gates, wherein the driving signal lines comprise at least two voltage signal lines arranged adjacent to each other; at least one isolation protecting line, the isolation protecting line being located between the two voltage signal lines arranged adjacent to each other.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

A method for preventing corona effects in an electronic circuit comprising the steps of applying a parylene coating to a surface of the electronic circuit, and applying a polyalphaolefin dielectric oil having a dielectric constant that is lower than that of the parylene coating on an exposed surface of the first material.

A circuit board has an upper face and a lower face. The circuit board comprises at least two circuits, with each of the at least two circuits comprising at least one conductor track and at least one current carrying electronic component. The circuit board has at least one through-hole which is provided with at least one insulating unit. The at least one insulating unit is arranged in the at least one through-hole and so is mechanically connected to the circuit board and thus is positioned between a first circuit and at least one second circuit of the circuit board.

A circuit assembly includes a sealable enclosure and at least one electronic circuit element contained within the sealable enclosure. The at least one electronic circuit element includes a control circuit, a garnet, and a first polymer material applied on a surface of the control circuit and on a surface of the garnet. A second polymer material fills a remaining space defined within the enclosure, the second polymer material applied on an exposed surface of the first material.

A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.

A circuit board includes: a bus bar; a first prepreg that is overlaid on the bus bar; and a sheet-like leakage prevention portion that is overlaid on the surface of the first prepreg and suppresses leakage of the first prepreg to the outside.