The present invention provides a composite member which includes an insulating spacer having a creepage surface withstand voltage higher than that of the related art even in an AC device in the atmosphere, can downsize a high-voltage device, and can improve insulation reliability. A composite member of the present invention includes a first conductor, a second conductor that is disposed at a predetermined interval from the first conductor and has a potential different from a potential of the first conductor, and an insulating spacer that supports the first conductor and the second conductor, in which an uneven portion having a length of 1/100 or more with respect to a length along a creepage surface of the insulating spacer is formed in a portion located between the first conductor and the second conductor in the insulating spacer.

Disclosed is a connector including at least: a printed circuit board including preferentially a plurality of stacked layers; a plurality of connecting pins which are spaced apart from each other and transversally pass through the printed circuit board from a bottom external surface up to an opposite top external surface of the printed circuit board; and an insulating assembly for providing insulation among the plurality of connecting pins, wherein the insulating assembly includes at least one insulator which is configured to be coupled to the printed circuit board and is configured to insulate at least a portion of each connection pin from a corresponding portion of one or more adjacent connecting pins of the plurality of connecting pins.

A printed circuit board includes: a base substrate including a unit region; a plurality of connection pads disposed on one surface of the base substrate; and first and second lead-in lines disposed on the one surface and respectively connected to at least a portion of the plurality of connection pads. The first and second lead-in lines have first and second cut surfaces on the one surface, respectively. The first cut surface is disposed in a position spaced apart from a side surface of the printed circuit board. The second cut surface is exposed to the side surface of the printed circuit board.

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

An image forming apparatus includes an image forming portion, a frame, which is a part of a main assembly frame, extending along a predetermined plane, a cover provided outside of the frame and extending along the predetermined plane and a circuit board, provided between the frame and the cover with in a direction perpendicular to the predetermined plane and extending along the predetermined plane. An opening portion penetrating the circuit board is formed in the circuit board. The frame includes a first abutting portion protruding toward the circuit board and the cover includes a second abutting portion protruding toward the circuit board. The first and second abutting portions are opposite to each other via the circuit board and positioned in an area where the opening portion of the circuit board is sandwiched therebetween in the direction perpendicular to the predetermined plane.

A multi-phase busbar for conducting electric energy includes: a base layer of an insulating material; a first conducting layer of a sheet metal; a first insulating layer of an insulating material arranged on the first conducting layer; a second conducting layer of a sheet metal arranged on the insulating layer; and a second layer of an electrically insulating material which is arranged on the second conducting layer. The first and/or second insulating layers include spacers, each spacer including a layer of a rigid insulating material. At least one of the spacers is glued to an electrically insulating coating of the first and/or second conducting layer, and/or at least one of the spacers is glued to an electrically conductive surface of an uncoated first and/or second conducting layer by an adhesive.

Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.

Provided are a circuit board including an insulating layer including a thermoplastic liquid crystal polymer and having excellent insulation reliability under a high voltage; and a high voltage device using the same. The circuit board (30) is a high voltage circuit board including an insulating layer (31) and a high voltage circuit layer (34), wherein the insulating layer includes a thermoplastic liquid crystal polymer. It is preferable that the circuit board includes a heat dissipation part (39) for dissipating heat from the insulating layer (31).