Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

A system board includes at least one microprocessor coupled to the system board. A VR module card includes a voltage regulator circuit, wherein the voltage regulator circuit is configured to provide electrical power to the at least one microprocessor. A circuit board region is configured to receive the VR module card.

To provide a substrate for a medical device and a medical device in which the reference potential of a patient circuit can be stabilized, the noise between the patient circuit and a ground-side circuit can be reduced, and the insulation distance between the patient circuit and the ground-side circuit can be sufficiently ensured without using a large-sized electronic component.

A patient circuit that is a circuit on the side of being brought into contact with or inserted into a subject, a ground-side circuit that is a circuit provided on the side of performing processing on a signal transmitted from the side of being brought into contact with or inserted into the subject and protectively grounded, an insulating layer provided between the patient circuit and the ground-side circuit and providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the surface of the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit are included.

To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.

A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0 W/mk and a dielectric breakdown strength of at least 3.0 kV/mm.

A printed wiring board includes a primary circuit that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit that is used when a low voltage component used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source are provided; a pattern for a common circuit that is used when a high voltage component used for the high voltage and the low voltage that insulates the pattern for the primary circuit from the pattern for the common circuit; a first insulator which insulates the pattern of the primary circuit from the pattern of the common circuit; and a second insulator that insulates the pattern for the common circuit from the pattern for the low voltage circuit.

An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

A power supply module having two output voltages includes an inductor module and a main board. The inductor module includes a first magnetic core, a second magnetic core, an intermediate magnetic core disposed therebetween, a first winding and a second winding. The first winding is disposed on one of a magnetic column of the first magnetic core and a magnetic column of the intermediate magnetic core to form a first inductor. The second winding is disposed on one of a magnetic column of the second magnetic core and a magnetic column of the intermediate magnetic core to form a second inductor. There is no air gap at a portion of the intermediate magnetic core where magnetic paths of the first and second inductors pass through together. The inductor module is disposed on the main board. The first winding and the second winding are electrically connected with the main board.

The present subject matter relates to a battery module for use in a vehicle. The battery module may include a housing, a plurality of battery cells disposed within the housing, and solid state pre-charge control circuitry that pre-charges a direct current (DC) bus that may be coupled between the battery module and an electronic component of the vehicle. Furthermore, the solid state pre-charge control circuitry may include solid state electronic components as well as passive electronic components.

An image display device includes an image display panel, data drive circuits, a timing control circuit, flexible printed circuits arranged between at least two of the liquid crystal panel, the data drive circuits, and the timing control circuit, to electrically connect the at least two of the liquid crystal panel, the data drive circuits, and the timing control circuit, printed circuit boards arranged between at least two of the data drive circuits, the flexible printed circuit, and the timing control circuit, to electrically connect the at least two of the data drive circuits, the flexible printed circuit, and the timing control circuit, and an element formation portion provided at at least one of the flexible printed circuit and the printed circuit board while including electrical elements regularly arranged on the element formation portion in accordance with at least one predetermined rule.