A circuit assembly includes a first conductive member; a second conductive member; and a holding member that is insulating and holds the first conductive member and the second conductive member; wherein the first conductive member has a first exposed surface exposed from the holding member, the second conductive member has a second exposed surface exposed from the holding member, the holding member includes an insulating portion located between the first exposed surface and the second exposed surface, and a conductive film covers at least a part of the first exposed surface and at least a part of the second exposed surface, while extending over the insulating portion.

A circuit assembly includes: a first conductive member; a second conductive member; a holding member that is insulating and holds the first conductive member and the second conductive member; and an electronic component that includes a first terminal and a second terminal. The first conductive member has a first exposed surface exposed from the holding member so as to be electrically connected to the first terminal, the second conductive member has a second exposed surface exposed from the holding member so as to be electrically connected to the second terminal, the holding member includes an insulating portion located between the first exposed surface and the second exposed surface, a first conductive film is provided, the first conductive film covering at least a part of the first exposed surface and part of the insulating portion, and the first terminal is electrically connected to the first conductive film.

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

A battery pack includes battery cells arranged in a first direction, and a busbar assembly coupled to upper portions of the battery cells, the busbar assembly having a busbar electrically connected to the battery cells, a flexible substrate configured to measure a state information of the battery cells, and an insulating film surrounding the busbar and the flexible substrate.

A memory module including: a first printed circuit board; a first socket and a second socket; and a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer facing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.

A printed circuit board power cell having a printed circuit board including a DC bus disposed within the printed circuit board. The printed circuit board power cell includes a plurality of capacitors connected to the DC bus, a three-phase AC input disposed on the printed circuit board and a single-phase AC output disposed on the printed circuit board. The printed circuit board power cell also includes a power module connected to the DC bus, the three-phase AC input and the single-phase AC output, wherein the power module receives three phase AC input power via the three-phase AC input and responsively outputs a single-phase AC power via the single-phase AC output.

A flexible printed wiring board according to an aspect includes a base film, a conductive pattern disposed on one surface of the base film, and an extra length absorbing portion protruding from the base film and disposed in a direction of a plane, the extra length absorbing portion including a pattern connected portion connected to the conductive pattern, a coupling portion having a first linear wiring portion, a first arcuate wiring portion, and a second linear wiring portion coupled in this order continuously from the pattern connected portion, and a connecting terminal connected to the coupling portion, the pattern connected portion and the connecting terminal being opposite to each other in a direction in which the extra length absorbing portion protrudes.

A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar.