An electronic component mounting structure is an electronic component mounting structure in which an electronic component group is mounted on a substrate, and a pattern constituting a part of a current path between the inflow port and the outflow port, the electronic component group includes a plurality of electronic components connected between the inflow port and the outflow port, each of the electronic components has a current inflow terminal electrically connected to the inflow port and a current outflow terminal electrically connected to the outflow port, and one of a first spatial distance group and a second spatial distance group has equal spatial distances within the one spatial distance group, and the first spatial distance group includes spatial distances between the inflow port and the inflow terminals, and the second spatial distance group includes spatial distances between the outflow port and the outflow terminals.

Provided is a conductive particle which can effectively suppress occurrence of connection failure. A conductive particle (1, 11, 21) according to the present invention is a conductive particle including a base particle (2) and a conductive portion (3, 12, 22) disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 μm or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are performed once is 1.5 or less.

A method is provided for producing a printed circuit board including at least one conductor element, which extends between connection points in the printed circuit board. In order to increase the productivity of a known method for producing a printed circuit board including at least one conductor element, which extends between connection points in the printed circuit board, the method comprises the following steps: Step A: providing a mold having at least one receptacle for a conductor element; Step B: arranging a conductor element in the receptacle of the mold; Step C: connecting the conductor element arranged in the receptacle of the mold to an electrically conductive sheetlike element at positions of the intended connection points; Step D: embedding the conductor element, which is connected to the electrically conductive sheetlike element, into insulating material; and Step E: working out the connection points from the electrically conductive sheetlike element.

A wiring substrate includes a first conductive plate, a second conductive plate, and a first insulator. A first end of an element is connected to a first main surface of the first conductive plate, and a second end of the element is connected to a first main surface of the second conductive plate. The first insulator includes a first portion and a second portion. The first portion separates the first conductive plate and the second conductive plate from each other. The second portion is continuous with the first portion, and covers at least a portion of the first main surface. The first portion includes an end portion. The end portion protrudes from the second main surface to the opposite of the first main surface or from the second main surface to the opposite of the first main surface.

A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.

A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.

A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

A functional electronics unit for a high current component which is provided for electrical and mechanical connection to a circuit board or to another mechanical carrier substrate for a circuit grouping or circuit, with conductor tracks, conductive surface elements and/or other conductive regions and contacts, the functional electronics unit having electronic components which are designed to measure properties of the electric current flowing through the component or of an electric voltage applied to the component or to perform another electronic functionality, is characterized in that the functional electronics unit is retained on the high current component or on a common carrier. More particularly, the functional electronics unit can be integrated into the high current components and/or can be pushed onto the high current component in a modular fashion or can be fixed on the high current component.

High-current circuit having a printed circuit board comprising a non-conductive substrate 2, a conductor layer 4 applied to the substrate 2 and an insulation layer 6 applied to the conductor layer, contact pads 8, 10, 12, 20, 22, 24 in each case interrupting the insulation layer 6 being arranged on both sides of the conductor plate, and the contact pads 8, 10, 12, 20, 22, 24 making contact with one another via vias 14 through the substrate 2, and the vias 14 being arranged in the area of the contact pads 8, 10, 12, 20, 22, 24, 10, 12, 20, 22, 24, characterized in that at least a first one of the contact pads 8 is arranged on a first side of the printed circuit board and a first semiconductor switch 28 is connected directly to at least a second one of the contact pads 20 on a second side of the printed circuit board, and in that the semiconductor switch 28 is connected to the first contact pad 8 directly via the vias 14 and the second contact pad 20, without further conductor tracks.