A display assembly includes: a display panel including a driving circuit and a first pad; and a flexible circuit board including a flexible base plate, a first wiring layer and a first reinforcement plate. The first wiring layer is on the flexible base plate and includes a main routing portion and a second pad, and the first reinforcement plate is on a side of the first wiring layer distal to the flexible base plate; an orthogonal projection of the main routing portion on the flexible base plate is within an orthogonal projection of the first reinforcement plate on the flexible base plate; the second pad is connected to the main routing portion, and is electrically connected to the first pad; the first reinforcement plate is outside the display panel and has a first edge proximal to the display panel The first edge includes convex and concave portions alternately arranged.

A flexible polymeric film includes a reinforcement layer and a base layer. The reinforcement layer includes a lamella and a plurality of columns. The columns are on a surface of the lamella. Each of the columns extends in a direction and is separated from a neighboring column by a gap. The base layer is coupled to the columns and portions of the surface of the lamella in the gaps between the columns. The base layer is less rigid than the reinforcement layer. The flexible polymeric film can be produced by spraying a precursor onto a substrate. A layer of the precursor is formed on the substrate and exposed to an energy beam to form a preliminary film on the substrate. The columns can be formed from a plurality of portions of the preliminary film. The lamella is formed on top of the preliminary film that is formed with the columns.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

A circuit substrate (3) is provided with first and second rigid parts (11, 12) having six metal foil layers, and a thin flexible part (13) having two metal foil layers connecting the two rigid parts. A ground wiring (51) which is shaped like a wide strip is formed on the surface metal foil layer, and a plurality of inter-rigid-part wirings (55) are formed on the inner metal foil layer in parallel lines. Outer edges (51a) of the ground wiring (51) are positioned closer to side edges (13a) of the flexible part (13) than to the inter-rigid-part wirings (55). The ground wiring (51) protects the inter-rigid-part wirings (55) from cracks.

An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.

A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

According to one embodiment, a display device includes a first substrate including a first area and a second area, the first area including a display area where pixels are arranged, and the second area being adjacent to the first area and where wirings are arranged, wherein the wirings are covered with a protection layer, the second area includes a peripheral area and a central area in an arrangement direction of the wirings, and a thickness of at least one of the first substrate and the protection layer varies between the peripheral area and the central area.

A display device includes a display panel, a support film, and a polymer layer. The display panel includes a display area comprising a first area that is bendable, and a non-display area adjacent to the display area. The support film is coupled to a bottom surface of the display panel. The support film includes a first groove overlapping with the first area. The polymer layer is disposed in the first groove. The polymer layer includes a material with higher flexibility than the support film. Angles formed by the top surface of the support film and inner sides of the support film defining the first groove are acute angles.

A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.