A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 μm to 0.9 μm thick.

According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

According to one embodiment, FPC has a flexible board body, a reinforcing plate, an opening portion, and a bent structure. The opening portion is formed to penetrate through the board body. The bent structure is bent to pass through the inside of the opening portion.

A printed circuit board according to an embodiment of the present invention includes a core layer and a circuit wiring layer disposed on a top surface of the core layer. The core layer is spaced apart from the circuit wiring layer and includes through-holes formed around the circuit wiring layer. Flexibility of the printed circuit board may be enhanced by the through-hole to obtain bending stability.

A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached to a rear surface of the display panel. When the flexible printed circuit board is flexed to be partially positioned on the rear surface of the display panel, the protection member is positioned between the display panel and the integrated circuit chip. The flexible display device prevents the integrated circuit chip stacked with the display panel from making direct contact with the display panel using the protection member. Thus, even if the display device is deformed into, for example, a flexed or rolled state, it is possible to prevent the display panel from being damaged.

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.

Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.

A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.

The present disclosure provides a flexible substrate of a bendable display device and a manufacturing method thereof, the flexible substrate includes a bendable base layer, which includes a bending region and a non-bending region; the flexible substrate further includes a fiber reinforced layer, which is provided on a surface of the base layer and has different distribution densities in the bending region and the non-bending region. The flexible substrate of a bendable display device provided in the present disclosure can not only protect semiconductor devices on the flexible substrate, and avoid situations such as dislocation of circuits of electronic components, low yield rate and etc., but can also disperse bending stress generated when the flexible substrate is bent, thereby prolonging the bending life of the display device.

A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.