According to one embodiment, a flexible substrate includes flexible insulating base material, conductive lines, a support body and a coating layer. The conductive lines are provided on the insulating base material. The support body supports the insulating base material. The coating layer covers the insulating base material and the support body. The conductive lines include scanning lines and signal lines. The scanning lines extend in a first direction and are arranged side by side in a second direction intersecting the first direction. The signal lines extend in the second direction and are arranged side by side in the first direction. The support body and the coating layer have a through hole in a region enclosed by two adjacent scanning lines and two adjacent signal lines.

Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

In one embodiment, the light-emitting diode module comprises a carrier and a plurality of light-emitting diodes. Thereby, several types of light-emitting diodes are present. The light-emitting diodes can be controlled individually or in groups electrically independently of one another. The light-emitting diodes each comprise a first and a second electrical contact. The carrier comprises several electrically conductive main layers, between each of which there is an electrically insulating intermediate layer. The contacts of the light-emitting diodes are attached to a carrier upper side on one of the first main layers. Starting from the first contacts, electrical through-connections are each connected directly to a carrier underside with a last main layer of the main layers. Starting from the second contacts, electrical through-connection each terminate at a penultimate main layer of the main layers, wherein the penultimate main layer is located inside the carrier.

According to one embodiment, a flexible substrate includes a flexible insulation base material and a plurality of wiring lines provided on one surface side of the insulation base material, and the insulation base material includes a thinned first area and a second area having a thickness larger than that of the first area, the first area includes a first lower surface, the second area includes a second lower surface, the first lower surface and the second lower surface are formed on an opposite side of a surface on which the wiring lines are provided, and the first lower surface includes an inclined portion inclined towards the second lower surface.

In one embodiment, the light-emitting diode module comprises a carrier and a plurality of light-emitting diodes. Thereby, several types of light-emitting diodes are present. The light-emitting diodes can be controlled individually or in groups electrically independently of one another. The light-emitting diodes each comprise a first and a second electrical contact. The carrier comprises several electrically conductive main layers, between each of which there is an electrically insulating intermediate layer. The contacts of the light-emitting diodes are attached to a carrier upper side on one of the first main layers. Starting from the first contacts, electrical through-connections are each connected directly to a carrier underside with a last main layer of the main layers. Starting from the second contacts, electrical through-connection each terminate at a penultimate main layer of the main layers, wherein the penultimate main layer is located inside the carrier.

According to one embodiment, a flexible substrate includes a support plate including a first surface, a line portion located on the first surface and including a first side surface and a second side surface on an opposite side to the first side surface and a protective member which covers the line portion, in contact with the first surface. The line portion includes a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, the protective member is separated from at least a part of the first side surface via an air layer and from at least a part of the second side surface via an air layer, and the air layers extend along the line portion.

According to one embodiment, a flexible substrate includes an insulating base including a first surface and a second surface on an opposite side to the first surface, a wiring layer provided on the second surface side of the insulating base and a resin layer including a support located on the first surface side of the insulating base and a coating layer located on the second surface side of the insulating base, the resin layer including a first area and a second area in planar view, the resin layer having a first elastic modulus in the first area and a second elastic modulus in the second area, and the first elastic modulus being greater than the second elastic modulus.

An optimally interconnected matrix of endpoints involves one or more conductive lanes of a substrate to be incorporated within a housing, with a plurality of conductive blocks positioned transverse to the conductive lanes. Any number of endpoints can be connected to any end of the conductive blocks. The endpoints can be interconnected by activating individual depressible terminals of the conductive lanes. Each depressible terminal is positioned above a conductive block, and activating a depressible terminals allows an electrical contact to be established between the corresponding conductive lane and the corresponding conductive block. The depressible terminals can be activated by extending a conductive or nonconductive pin through individual apertures of the housing which are positioned over the depressible terminals.

An optimally interconnected matrix of endpoints involves one or more conductive lanes of a substrate to be incorporated within a housing, with a plurality of conductive blocks positioned transverse to the conductive lanes. Any number of endpoints can be connected to any end of the conductive blocks. The endpoints can be interconnected by activating individual depressible terminals of the conductive lanes. Each depressible terminal is positioned above a conductive block, and activating a depressible terminals allows an electrical contact to be established between the corresponding conductive lane and the corresponding conductive block. The depressible terminals can be activated by extending a conductive or nonconductive pin through individual apertures of the housing which are positioned over the depressible terminals.

According to one embodiment, an electronic device includes a first insulating substrate having elasticity and including a plurality of first island-shaped portions and a first strip-shaped portion formed into a meandering strip shape and connecting the first island portions arranged along a first direction, first sensor electrodes disposed on each of the first island-shaped portions and a first sensor wiring line disposed on the first strip-shaped portion, meandering along the first strip-shaped portion, and connected to the first sensor electrode.