According to one embodiment, a flexible substrate includes a support plate including a first surface, a line portion located on the first surface and including a first side surface and a second side surface on an opposite side to the first side surface and a protective member which covers the line portion, in contact with the first surface. The line portion includes a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, the protective member is separated from at least a part of the first side surface via an air layer and from at least a part of the second side surface via an air layer, and the air layers extend along the line portion.

An electronic circuit includes: a motherboard; an input/output connector including at least one group containing N input/output contacts; a set containing expansion slots having expansion contacts electrically connected to input/output contacts; each input/output contact being identified by an identifier T, each expansion slot being identified by an identifier S, each connected expansion contact being identified by an identifier R, for: each expansion slot of identifier S; and each connected expansion contact of identifier R. Each input/output contact of identifier T is electrically connected to a single expansion contact of identifier R of the expansion slot of identifier S, and the identifier T is calculated according to the following relation: T[(R+DS) modulo (N)], where D is fixed in each group and is an integer sub-multiple of the natural number N.

A conductive component includes: a first electrode pattern which is made of metal thin wires, the first electrode pattern including a plurality of first conductive patterns that extend in a first direction. Each first conductive pattern includes, at least, inside thereof, a sub-nonconduction pattern that is electrically separated from the first conductive pattern. An area A of each first conductive pattern and an area B of each sub-nonconduction patterns satisfy a relation of 5%<B/(A+B)<97%. The conductive component may be included in a conductive sheet and a touch panel to provide a high detection accuracy.

The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

A touch panel includes a first electrode formed of first thin metal wires arranged in the transmissive region and a second electrode insulated from the first electrode and formed of second thin metal wires arranged to intersect the first thin metal wire in the transmissive region, in which the second thin metal wires is arranged on the side opposite to the viewing side than the first thin metal wires.

In a customizable circuit an interconnect matrix is provided that includes only two conductive layers, the matrix defining a first layer of L-shaped conductive lines and a second layer of substantially L-shaped conductive line segments that are connected to electrical components.

According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

A textile fabric containing a first electrically conductive thread and a second electrically conductive thread is disclosed. In one aspect, the first electrically conductive thread and the second electrically conductive thread cross at a first crossover point, wherein the textile fabric further contains an electrical connector establishing an electrical connection between the first electrically conductive thread and the second electrically conductive thread. The electrical connector contains a first contact pad in electrical contact with the first electrically conductive thread, a second contact pad in electrical contact with the second electrically conductive thread, and a first stretchable electrical interconnection connecting the first contact pad with the second contact pad. The first contact pad and the second contact pad are provided at a location different from the location of the first crossover point. Methods for electrically interconnecting crossing electrically conductive threads of textile fabrics are also disclosed.

The present invention relates generally to electric circuit testing, building, or implementing using a breadboard-style printed circuit board (PCB). Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In one or more embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points may be built. In one or more embodiments, an embedded wire and solder bridge is capable of connecting a column of signal tie points, and/or an embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit may be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wire.

A transparent conductive film includes a transparent insulating substrate, a first electrode, and a second electrode, in which a first thin metal wire 38 of the first electrode has a first front surface 38A being directed to the viewing side and having a line width W1A, and a first back surface 38B being directed to the side opposite to the viewing side and having a line width W1B, a second thin metal wire 39 of the second electrode has a second front surface 39A being directed to the viewing side and having a line width W2A, and a second back surface 39B being directed to the side opposite to the viewing side and having a line width W2B, the W1A, W1B, W2A, and W2B are 0.5 to 10 m, W1A is larger than W1B and W2A is larger than W2B.